LCMXO2-4000HC-4BG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 421 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-4BG256I – MachXO2 FPGA, 4,320 logic elements, 206 I/Os, 256-LFBGA
The LCMXO2-4000HC-4BG256I is a MachXO2 family Field Programmable Gate Array (FPGA) IC offering 4,320 logic elements and 206 I/Os in a 256-LFBGA package. It combines flexible logic fabric with on-chip non-volatile configuration and a wide, programmable I/O set to address interface-rich and embedded industrial applications.
Designed for systems that require low standby power, in-field reconfiguration and dense I/O integration, this device delivers a mix of memory, configurable I/O support and system-level features for streamlined board-level implementation.
Key Features
- Core Logic — 4,320 logic elements (logic cells) for implementing glue logic, protocol bridging and custom control functions.
- On-chip RAM — Total on-chip RAM: 94,208 bits, providing embedded and distributed memory for buffering and small data stores.
- I/O Density and Flexibility — 206 available I/Os with programmable sysIO buffer support for multiple interface standards and differential signaling modes.
- Low Power — Family-level ultra low power characteristics, including very low standby power options as documented for the MachXO2 family.
- Non‑volatile, Reconfigurable — On-chip user flash memory and single-chip instant-on, supporting background programming and TransFR in-field reconfiguration (family-level capability).
- System Functions — Integrated hardened peripherals and assist logic at the device/family level, including SPI, I²C, timers/counters and an on-chip oscillator.
- Package and Mounting — Surface-mount 256-LFBGA; supplier device package listed as 256-CABGA (14×14).
- Power and Temperature — Operates from 2.375 V to 3.465 V and specified for industrial temperature range of −40 °C to 100 °C.
- Standards and Compliance — RoHS compliant and supports in-system programming standards for board-level manufacturing and field updates.
Typical Applications
- Interface Bridging and Glue Logic — Use the high I/O count and flexible sysIO buffers to consolidate protocol translation and board-level interfacing.
- Display and Memory Interface Support — Source-synchronous and DDR-capable I/O features at the family level make the device suitable for display timing and memory buffering tasks.
- Industrial Control and Monitoring — Industrial grade rating and extended temperature range enable deployment in factory automation, motor control and instrumentation systems.
- Field Upgradeable Systems — Non-volatile on-chip flash plus in-field reconfiguration support enables remote updates and long-term feature enhancements without hardware replacement.
Unique Advantages
- Highly integrated I/O and logic — 4,320 logic elements combined with 206 I/Os reduce external glue logic and lower BOM complexity.
- Flexible interface support — Programmable sysIO buffers and differential I/O options enable a wide range of signaling standards for mixed-signal systems.
- Non-volatile instant-on capability — On-chip user flash and instant-on configuration provide fast boot and persistent configuration without external PROMs.
- In-field reconfiguration (TransFR) — Enables updating device logic while the system remains operational, supporting maintenance and feature upgrades.
- Industrial-ready operating window — Wide voltage supply range and −40 °C to 100 °C operating temperature support harsh environments and robust deployments.
- Compact, high-density package — 256-LFBGA / 256-CABGA (14×14) packaging balances board area with high I/O count for space-constrained systems.
Why Choose LCMXO2-4000HC-4BG256I?
This MachXO2 device is positioned for engineers who need a compact, reconfigurable, and interface-focused FPGA for industrial and embedded designs. With 4,320 logic elements, 206 I/Os, on-chip non-volatile configuration and family-level low-power and in-field update capabilities, it simplifies system level integration while enabling field maintenance and upgrades.
Choose this device when you require dense I/O, deterministic configuration behavior, and an industrial temperature range—delivering scalability across the MachXO2 family and long-term flexibility through reconfiguration and embedded memory resources.
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