LCMXO2-4000HC-4BG332C

The LCMXO2-4000HC-4BG332C is a MachXO2 family FPGA IC offering a mid-density, non-volatile programmable fabric. This device provides 4,320 logic elements and a high-pin-count interface with 274 I/Os in a 332-ball caBGA package, making it suitable for embedded control, interface bridging and system glue logic in commercial applications.

As part of the MachXO2 family, it combines flexible I/O, on-chip memory and low-power options with single-chip reprogrammability and configuration interfaces to simplify board-level integration and support in-field updates.

Key Features

• Logic Capacity — 4,320 logic elements (cells) to implement mid-density combinational and sequential logic functions.
• I/O Density — 274 I/Os in a 332-ball caBGA (17 mm × 17 mm) package for high connectivity and dense external interfacing.
• Embedded Memory — Approximately 94,208 bits of on-chip RAM for distributed memory needs and small buffering.
• On-Chip Non-volatile Memory (Family Feature) — MachXO2 family supports on-chip user flash memory (up to 256 kbits, per family datasheet) for configuration and user storage.
• Flexible Power Range — Single-supply operation across 2.375 V to 3.465 V to match varied system voltage domains.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature for commercial environments.
• Low-Power Options (Family Feature) — MachXO2 family includes ultra low power operation modes and standby options (family datasheet).
• Clocking and PLLs (Family Feature) — Family supports multiple primary clocks and up to two analog PLLs for flexible clock management (per family datasheet).
• Mounting and Package — Surface-mount CA BGA package (332-ball, supplier package 332-CABGA 17×17) for compact board-level integration.
• Standards and Programming Interfaces (Family Feature) — Supports JTAG, SPI and I²C configuration and programming modes according to the MachXO2 family documentation.

Typical Applications

• Interface Bridging: Use the high I/O count and flexible I/O buffer options to bridge between multiple serial and parallel interfaces.
• Display and Video I/O: Family-level features such as source-synchronous I/O and display gearing support make this device a fit for display timing and front‑end logic tasks.
• System Glue Logic: Implement board-level control, protocol translation and glue logic to reduce external components and simplify BOM.
• Configuration and In-Field Updates: On-chip non-volatile memory and TransFR reconfiguration (family feature) enable secure boot and field logic updates without external programmers.

Unique Advantages

• High connectivity in a compact package: 274 I/Os in a 17×17 mm caBGA provide dense external device interfacing without a large PCB footprint.
• Mid-density logic with embedded RAM: 4,320 logic elements together with ~94 kbits of embedded RAM enable implementation of complex glue logic and small buffering on-chip.
• Single-supply flexibility: Operates across 2.375 V to 3.465 V allowing compatibility with common system power rails.
• Non-volatile configuration and field updates: MachXO2 family on-chip flash and TransFR reconfiguration support secure, single-chip configuration and in-field logic updates.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match commercial embedded product requirements.
• Surface-mount, industry-standard package: 332-ball caBGA (17×17) supplier package simplifies assembly for volume production.

Why Choose LCMXO2-4000HC-4BG332C?

The LCMXO2-4000HC-4BG332C delivers a balanced combination of mid-density logic, substantial I/O capacity and on-chip memory within a compact caBGA footprint. It is positioned for commercial embedded designs that require flexible interface options, in-field reconfigurability and streamlined board-level integration.

Designers seeking a non-volatile, reconfigurable solution with family-level features such as on-chip flash, clocking/PLL resources and low-power modes can leverage this device to reduce external components and accelerate system development while maintaining commercial temperature requirements.

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