LCMXO2-4000HC-4FG484I

The LCMXO2-4000HC-4FG484I is a MachXO2 family Field Programmable Gate Array (FPGA) IC delivering 4,320 logic elements and 94,208 bits of on-chip RAM in a 484-ball fine-pitch BGA (23 mm × 23 mm) package. Designed for industrial-grade applications, this device combines flexible I/O, non-volatile on-chip flash, and system-level peripherals to support interface bridging, display and memory interfaces, and in-field reconfiguration.

Key Features

• Logic Capacity – 4,320 logic elements (LUT4 architecture) suitable for mid-density glue-logic, protocol bridging, and control functions.
• Embedded Memory – Approximately 94,208 bits of total on-chip RAM to support FIFOs, small frame buffers, and control state storage.
• On-Chip Non-Volatile Memory – Integrated user flash memory (UFM) for configuration and field updates as provided by the MachXO2 family.
• I/O Density and Flexibility – 278 I/Os with programmable sysIO buffers supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, PCI, LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL, SSTL, and HSTL signaling options.
• Pre-Engineered Source-Synchronous I/O – DDR registers in I/O cells, dedicated gearing logic and support for generic DDR, DDRX2, DDRX4 and dedicated DDR/DDR2/LPDDR memory interfaces with DQS support.
• Clocking and PLLs – Up to eight primary clocks and up to two analog PLLs with fractional-N synthesis for flexible clock generation and deskewing.
• Power and Standby – Advanced low-power process with standby modes and low-power options described for the MachXO2 family.
• Single-Supply and Voltage Range – Operates from 2.375 V to 3.465 V, simplifying power distribution options.
• Industrial Temperature Grade – Rated for operation from −40°C to 100°C to meet industrial environment requirements.
• Package and Mounting – 484-ball FBGA (23 mm × 23 mm, 1.0 mm) in a surface-mount package with advanced halogen-free packaging options.
• System-Level Integration – Hardened on-chip functions including SPI, I²C, timer/counter, on-chip oscillator, IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support.
• In-Field Reconfiguration – TransFR™ reconfiguration and background programming capabilities enable non-volatile, infinitely reconfigurable instant-on operation.
• RoHS Compliant – Device is RoHS compliant.

Typical Applications

• Industrial Control – Implements control logic, sensor interfacing, and protocol glue in industrial systems using the industrial temperature grade and broad I/O support.
• Display and Video Interfaces – Supports display I/Os with 7:1 gearing and DDR-friendly I/O cells for timing-critical display and graphics interface tasks.
• Interface Bridging and Protocol Conversion – Flexible sysIO buffer options and abundant I/O count enable bridging between diverse standards (LVDS, PCI, SSTL, etc.).
• Field-Upgradable Systems – On-chip flash and TransFR reconfiguration allow in-field logic updates and secure single-chip configuration for deployed equipment.

Unique Advantages

• High I/O Count in a Compact BGA: 278 I/Os in a 484-ball 23 mm × 23 mm FBGA package provide dense external connectivity without large board area.
• Integrated Memory and Logic Density: 4,320 logic elements and roughly 94,208 bits of RAM support complex glue logic, FIFOs, and small memory-backed functions on-chip.
• Flexible, Programmable I/O Standards: sysIO buffers support a wide range of standards, enabling multi-protocol designs and simplifying board-level transceiver requirements.
• Instant-On, Reconfigurable Non-Volatile Solution: On-chip flash and TransFR permit secure, instant-on operation and background or in-field updates without external configuration ROMs.
• Industrial Temperature and Wide Voltage Range: −40°C to 100°C operating range and 2.375 V–3.465 V supply compatibility make the device suitable for a variety of industrial environments and power schemes.
• System-Level Peripherals: Built-in SPI, I²C, timers, oscillator and boundary-scan support reduce BOM and speed system integration and validation.

Why Choose LCMXO2-4000HC-4FG484I?

The LCMXO2-4000HC-4FG484I positions itself as a versatile, industrial-grade mid-density FPGA that balances logic capacity, embedded memory, and a very high I/O count within a compact FBGA package. Its combination of programmable I/O standards, on-chip non-volatile memory, and in-field reconfiguration makes it suitable for designs that require flexible interfacing, reliable system-level features, and field updateability.

This device is well suited for engineers building industrial control systems, display and interface bridging solutions, and other applications requiring robust I/O, instant-on behavior, and system integration features. Density migration within the MachXO2 family and the device’s integrated peripherals support long-term design scalability and reduced BOM complexity.

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