LCMXO2-4000HC-4BG332I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 885 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-4BG332I – MachXO2 Field Programmable Gate Array (FPGA), 332-FBGA
The LCMXO2-4000HC-4BG332I is a MachXO2 family FPGA from Lattice Semiconductor Corporation designed for industrial embedded systems requiring reconfigurable logic, high I/O density and non-volatile configuration. This surface-mount device delivers 4,320 logic elements, approximately 94 kbits of on-chip RAM and up to 274 I/Os in a compact 332-ball FBGA (17 × 17 mm) package.
Built for applications that need flexible interfacing and reliable operation across a wide voltage and temperature range, the device combines MachXO2 family capabilities—such as instant-on configuration and in-field reconfiguration—with industrial-grade temperature tolerance and RoHS compliance.
Key Features
- Logic Capacity — 4,320 logic elements provide substantial programmable logic resources for glue logic, protocol bridging and control functions.
- Embedded Memory — Total on-chip RAM of 94,208 bits (approximately 94 kbits) suitable for FIFOs, small data buffers and control state storage.
- I/O Density — Up to 274 user I/Os in the 332-FBGA package to support complex interfacing and multi-port designs.
- Power and Supply — Single supply operating range from 2.375 V to 3.465 V to accommodate a range of system power architectures.
- Package and Mounting — 332-ball caBGA package (17 × 17 mm) with surface-mount mounting for compact board integration.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
- RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.
- MachXO2 Family Capabilities — Family-level features include on-chip user flash memory, ultra-low standby power modes, flexible I/O standards and support for in-field reconfiguration (see MachXO2 family datasheet for full details).
Typical Applications
- Industrial Control — Implements control logic, protocol conversion and peripheral aggregation where industrial temperature range and high I/O count are required.
- Embedded Systems — Acts as a single-chip programmable logic device for system glue, reset/boot management and in-field logic updates.
- Communications & Connectivity — Provides flexible interfacing and I/O density for bridging between multiple interfaces and supporting custom protocol logic.
- Display and Video Interfaces — Suitable for display I/O and source-synchronous interfaces where the MachXO2 family’s pre-engineered I/O features are beneficial.
Unique Advantages
- High I/O Count: 274 user I/Os enable dense connectivity without external multiplexing or additional interface ICs.
- Substantial Logic Resources: 4,320 logic elements provide room for moderate-complexity state machines, protocol logic and glue functions on a single device.
- On-Chip Memory: Approximately 94 kbits of embedded RAM suitable for buffering, FIFOs and small data stores, reducing external memory needs.
- Wide Supply Flexibility: Supports system voltages from 2.375 V to 3.465 V to integrate into varied power domains.
- Industrial Reliability: Specified for −40 °C to 100 °C operation, aligning with industrial deployment requirements.
- Compact, Surface-Mount Packaging: 332-ball caBGA (17 × 17 mm) balances I/O density with a small PCB footprint for space-constrained designs.
Why Choose LCMXO2-4000HC-4BG332I?
LCMXO2-4000HC-4BG332I positions as a versatile, industrial-grade FPGA option for designs that require a balance of logic capacity, high I/O count and on-chip memory in a compact package. Its MachXO2 family capabilities—such as instant-on configuration and support for in-field updates—make it suitable for applications where maintainability and rapid boot are important.
This device is appropriate for engineering teams building industrial controllers, embedded interface modules and communication subsystems who need a reliable, reconfigurable platform with clear electrical and thermal limits and reduced external component count.
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