LCMXO2-4000HC-4FG484C

The LCMXO2-4000HC-4FG484C is a MachXO2 family FPGA featuring a flexible 65 nm architecture optimized for low-power, instant-on system logic. It provides 4,320 logic elements, approximately 94,208 bits of on-chip RAM, and 278 I/Os in a 484-ball BGA package for compact, high-density applications.

Designed for system control, interface bridging and glue-logic roles, this device combines non-volatile user flash, programmable I/O flexibility and embedded memory to simplify integration and reduce BOM count in commercial-grade designs.

Key Features

• Core Logic  4,320 logic elements (LUT-based) for implementing glue logic, state machines and custom peripherals.
• Embedded Memory  Approximately 94,208 total RAM bits of on-chip memory suitable for distributed RAM and small FIFO implementations.
• On-Chip Flash  Non-volatile user flash memory (MachXO2 family feature) for single-chip, infinitely reconfigurable designs and in-field updates.
• High-Performance I/O  278 I/O pins with programmable sysIO buffer support and on-chip differential termination for a wide range of interface standards and source-synchronous DDR operation.
• Power  Designed on an advanced low-power process with support for stand-by modes; single power supply operation across a wide voltage range (2.375 V to 3.465 V).
• Clocking and Timing  Multiple primary clocks and up to two analog PLLs per device for flexible clock generation and fractional-n frequency synthesis (family feature).
• Package and Mounting  484-ball FBGA (23 × 23 mm) surface-mount package (484-BBGA footprint) for high I/O density in a compact footprint.
• Operating Range & Compliance  Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Interface Bridging  Use the device to translate and synchronize between different logic standards and bus interfaces, leveraging programmable I/O and DDR-ready I/O cells.
• Display and Memory Interfaces  Pre-engineered source-synchronous I/O and gearing support simplify implementation of display interfaces and DDR memory signaling.
• System Glue Logic  Replace discrete logic with integrated programmable logic for board-level control, protocol adaptation and peripheral aggregation.
• Field-Updatable Control  On-chip user flash and in-field reconfiguration enable firmware updates and feature upgrades without board replacement.

Unique Advantages

• Compact, High-Density I/O: 278 I/Os in a 484-ball package provide a dense pinout for complex interface requirements while keeping board area small.
• Integrated Non-Volatile Configuration: On-chip user flash enables instant-on behavior and secure single-chip configuration without external PROM, reducing component count.
• Flexible Power and I/O Standards: Wide supply voltage support (2.375–3.465 V) and programmable sysIO buffers accommodate multiple signaling standards and simplify power rail design.
• Embedded Memory for Local Data: Approximately 94 kbits of on-chip RAM supports FIFOs, small buffers and distributed RAM needs without external memory.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial applications.

Why Choose LCMXO2-4000HC-4FG484C?

The LCMXO2-4000HC-4FG484C positions itself as a compact, low-power FPGA option for commercial designs that need dense I/O, embedded memory and non-volatile configuration. With 4,320 logic elements, extensive I/O and on-chip flash, it simplifies system architecture by reducing external components and enabling in-field updates.

This device is well suited to engineers building control logic, interface bridges, display and memory interfaces, or any application that benefits from programmable, reconfigurable logic with commercial temperature operation and RoHS compliance.

Request a quote or submit a purchase inquiry to get pricing and availability for the LCMXO2-4000HC-4FG484C.