LCMXO2-4000ZE-3BG332C

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 156 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-3BG332C – MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

The LCMXO2-4000ZE-3BG332C is a MachXO2 family FPGA from Lattice Semiconductor designed for low-power, flexible system control and glue-logic applications. This surface-mount device integrates approximately 4,320 logic elements, roughly 94 kbits of on-chip RAM, and 274 user I/Os in a 332-ball caBGA (17 × 17 mm) package.

With a 1.14–1.26 V core supply range and a commercial operating temperature of 0 °C to 85 °C, the device targets embedded, consumer and general-purpose digital designs requiring instant-on nonvolatile logic, flexible I/O and in-field reconfiguration.

Key Features

  • Logic Capacity — Approximately 4,320 logic elements suitable for complex glue logic, control and interface tasks.
  • On‑chip Memory — Approximately 94,208 bits of total RAM for distributed and embedded memory needs within the FPGA fabric.
  • High I/O Count — 274 user I/Os provided in a 332-ball caBGA package, enabling dense connectivity to peripherals, sensors and memory buses.
  • Flexible I/O Buffering — MachXO2 family I/O architecture supports a wide range of standards and programmable modes (as defined by the MachXO2 family), enabling multiple interface types on-chip.
  • Low Power Architecture — Family-level low-power design options and power-saving modes support energy-conscious system designs.
  • Nonvolatile, Instant‑On Operation — MachXO2 family devices provide single-chip nonvolatile configuration and fast power-up from stored configuration memory.
  • Reconfiguration and System Support — Family features include in-field reconfiguration and on-chip system functions such as SPI, I2C and timer/counter blocks.
  • Package and Mounting — 332-FBGA (supplier package: 332-CABGA 17×17) for surface-mount assembly and compact system footprints.
  • Compliance and Grade — RoHS compliant and specified for commercial-grade operation (0 °C to 85 °C).

Typical Applications

  • Board-Level Glue Logic — Replace discrete glue components with programmable logic to consolidate interfaces, state machines and signal conditioning.
  • Peripheral and Sensor Aggregation — Aggregate and manage high pin‑count sensor and peripheral interfaces using the device’s abundant I/O resources.
  • Display and Connectivity Control — Implement display controllers, serial bridges or protocol converters that benefit from flexible I/O and embedded memory.
  • System Control and Configuration — Use for power sequencing, configuration management and supervisory logic with instant-on nonvolatile configuration.

Unique Advantages

  • High I/O Density: 274 I/Os in a 332-ball caBGA package provide extensive external connectivity without increasing board area.
  • Integrated Memory and Logic: Nearly 94 kbits of on-chip RAM combined with 4,320 logic elements reduces external component count for buffering and small data structures.
  • Low-Voltage Core: Narrow 1.14–1.26 V supply range aligns with low-power system designs and simplifies power-rail planning for the core domain.
  • Commercial Temperature Support: Rated 0 °C to 85 °C for mainstream embedded and consumer products.
  • RoHS Compliant: Complies with RoHS requirements to meet environmental and manufacturing standards.
  • Surface-Mount Package: 332-FBGA surface-mount form factor supports compact, automated assembly and high-density PCB layouts.

Why Choose LCMXO2-4000ZE-3BG332C?

The LCMXO2-4000ZE-3BG332C positions itself as a compact, low-power, nonvolatile FPGA solution for designs that need substantial logic and I/O in a small footprint. Its combination of approximately 4,320 logic elements, roughly 94 kbits of on-chip RAM and 274 I/Os in a 17 × 17 mm caBGA package makes it suitable for consolidating interfaces, implementing control logic and enabling in-field updates without external configuration components.

Designed for commercial embedded and consumer applications, the device offers a balance of integration, reconfiguration capability and system-level support from the MachXO2 family to help reduce BOM, simplify board design and accelerate time-to-market.

Request a quote or submit an inquiry to learn more about availability and volume pricing for LCMXO2-4000ZE-3BG332C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up