LCMXO2-4000ZE-3BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 156 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-3BG332C – MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA
The LCMXO2-4000ZE-3BG332C is a MachXO2 family FPGA from Lattice Semiconductor designed for low-power, flexible system control and glue-logic applications. This surface-mount device integrates approximately 4,320 logic elements, roughly 94 kbits of on-chip RAM, and 274 user I/Os in a 332-ball caBGA (17 × 17 mm) package.
With a 1.14–1.26 V core supply range and a commercial operating temperature of 0 °C to 85 °C, the device targets embedded, consumer and general-purpose digital designs requiring instant-on nonvolatile logic, flexible I/O and in-field reconfiguration.
Key Features
- Logic Capacity — Approximately 4,320 logic elements suitable for complex glue logic, control and interface tasks.
- On‑chip Memory — Approximately 94,208 bits of total RAM for distributed and embedded memory needs within the FPGA fabric.
- High I/O Count — 274 user I/Os provided in a 332-ball caBGA package, enabling dense connectivity to peripherals, sensors and memory buses.
- Flexible I/O Buffering — MachXO2 family I/O architecture supports a wide range of standards and programmable modes (as defined by the MachXO2 family), enabling multiple interface types on-chip.
- Low Power Architecture — Family-level low-power design options and power-saving modes support energy-conscious system designs.
- Nonvolatile, Instant‑On Operation — MachXO2 family devices provide single-chip nonvolatile configuration and fast power-up from stored configuration memory.
- Reconfiguration and System Support — Family features include in-field reconfiguration and on-chip system functions such as SPI, I2C and timer/counter blocks.
- Package and Mounting — 332-FBGA (supplier package: 332-CABGA 17×17) for surface-mount assembly and compact system footprints.
- Compliance and Grade — RoHS compliant and specified for commercial-grade operation (0 °C to 85 °C).
Typical Applications
- Board-Level Glue Logic — Replace discrete glue components with programmable logic to consolidate interfaces, state machines and signal conditioning.
- Peripheral and Sensor Aggregation — Aggregate and manage high pin‑count sensor and peripheral interfaces using the device’s abundant I/O resources.
- Display and Connectivity Control — Implement display controllers, serial bridges or protocol converters that benefit from flexible I/O and embedded memory.
- System Control and Configuration — Use for power sequencing, configuration management and supervisory logic with instant-on nonvolatile configuration.
Unique Advantages
- High I/O Density: 274 I/Os in a 332-ball caBGA package provide extensive external connectivity without increasing board area.
- Integrated Memory and Logic: Nearly 94 kbits of on-chip RAM combined with 4,320 logic elements reduces external component count for buffering and small data structures.
- Low-Voltage Core: Narrow 1.14–1.26 V supply range aligns with low-power system designs and simplifies power-rail planning for the core domain.
- Commercial Temperature Support: Rated 0 °C to 85 °C for mainstream embedded and consumer products.
- RoHS Compliant: Complies with RoHS requirements to meet environmental and manufacturing standards.
- Surface-Mount Package: 332-FBGA surface-mount form factor supports compact, automated assembly and high-density PCB layouts.
Why Choose LCMXO2-4000ZE-3BG332C?
The LCMXO2-4000ZE-3BG332C positions itself as a compact, low-power, nonvolatile FPGA solution for designs that need substantial logic and I/O in a small footprint. Its combination of approximately 4,320 logic elements, roughly 94 kbits of on-chip RAM and 274 I/Os in a 17 × 17 mm caBGA package makes it suitable for consolidating interfaces, implementing control logic and enabling in-field updates without external configuration components.
Designed for commercial embedded and consumer applications, the device offers a balance of integration, reconfiguration capability and system-level support from the MachXO2 family to help reduce BOM, simplify board design and accelerate time-to-market.
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