LCMXO2-4000ZE-3FG484C

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 417 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O278Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-3FG484C – MachXO2 FPGA, 4,320 Logic Elements, 278 I/Os

The LCMXO2-4000ZE-3FG484C is a MachXO2 family field programmable gate array (FPGA) in a 484-ball BGA package. It provides 4,320 logic elements, approximately 94,208 bits of on-chip RAM and 278 I/Os in a surface-mount form factor for commercial-grade embedded designs.

Designed for low-power, instant-on system functions and I/O-centric glue logic, this device targets applications that require flexible programmable logic, memory, and a broad set of configurable I/O options while operating from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity — 4,320 logic elements suitable for mid-density programmable logic tasks and glue logic integration.
  • Embedded Memory — Approximately 94,208 bits of total on-chip RAM for distributed and block memory needs.
  • I/O Density & Package — 278 I/Os in a 484-ball BGA (484-FBGA, 23 mm × 23 mm) package; surface mount mounting type supports high I/O-count board designs.
  • Low Power Operation — Family-level low-power architecture with standby modes; series documentation cites ultra-low standby power options.
  • On-Chip Non-Volatile Options — Family support for on-chip user flash memory enabling instant-on and in-field reconfiguration capabilities.
  • Flexible I/O Standards — Programmable sysIO buffer supports a wide range of interfaces (including multiple LVCMOS voltages, LVTTL, LVDS, and others) for diverse board-level protocols.
  • Clocking and PLLs — Multi-clock architecture with multiple primary clocks and up to two analog PLLs per device to support varied clocking requirements.
  • System-Level Support — Hardened peripherals and functions available in the family (SPI, I2C, timers/counters, boundary scan) for common system control tasks.
  • Compliance & Grade — Commercial grade device with RoHS compliance; operating range 0 °C to 85 °C.

Typical Applications

  • Interface Bridging and Glue Logic — Use the programmable logic and extensive I/O count to consolidate serial and parallel interfaces between system components.
  • Display and Memory Interface — Pre-engineered source-synchronous I/O and DDR-friendly I/O cells make the device suitable for display timing, DDR gear logic and memory interface control.
  • Embedded Control and System Management — On-chip user flash, timers/counters, SPI and I2C support enable system initialization, configuration storage and supervisory functions.

Unique Advantages

  • Highly Integrated Mid-Density FPGA: 4,320 logic elements with substantial on-chip RAM reduce the need for external components when implementing glue logic and mid-complexity control functions.
  • High I/O Count in Compact Package: 278 I/Os in a 484-ball BGA (23 mm × 23 mm) provide ample connectivity for I/O-heavy board designs while keeping PCB footprint manageable.
  • Instant-On and In-Field Reconfiguration: Family-level non-volatile and TransFR reconfiguration features enable fast power-up and field updates without external configuration devices.
  • Flexible, Programmable I/O Standards: The sysIO buffer supports multiple signaling families, allowing the device to interface with a wide variety of peripherals and board-level protocols.
  • Power-Conscious Design: Low-power process options and standby modes help minimize system power draw for always-on or energy-sensitive functions.
  • System Support and Hardened Peripherals: Built-in SPI, I2C, timers/counters and boundary-scan support speed system integration and testing.

Why Choose LCMXO2-4000ZE-3FG484C?

This MachXO2 FPGA offers a balance of programmable logic capacity, on-chip memory and a high I/O count in a compact 484-ball BGA package, making it well suited for mid-density embedded designs that require flexible interfacing and in-field configurability. Its commercial temperature rating and RoHS compliance align with mainstream electronic product requirements.

Engineers seeking to consolidate board functions, implement complex I/O routing or add secure, non-volatile configuration capability will find the LCMXO2-4000ZE-3FG484C a practical choice for reducing BOM complexity and enabling rapid system bring-up.

Request a quote or submit an inquiry to evaluate the LCMXO2-4000ZE-3FG484C for your next embedded design project.

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