LCMXO2-4000ZE-3FTG256I

The LCMXO2-4000ZE-3FTG256I is a MachXO2 family FPGA from Lattice Semiconductor Corporation featuring approximately 4,320 logic elements, about 94 kbits of embedded RAM, and 206 user I/Os in a 256-ball BGA package. It combines a low-power 65 nm process architecture with non-volatile configuration and flexible I/O, making it suitable for dense glue logic, interface bridging, and I/O-rich embedded designs.

Designed for industrial-grade operation, the device supports a single low-voltage core supply and an extended operating temperature range, offering integration options for systems that require reconfiguration, on-chip memory, and a large I/O count.

Key Features

• Core Logic Approximately 4,320 logic elements provide the programmable logic capacity for glue logic, state machines, and custom acceleration functions.
• Embedded Memory Total on-chip RAM of 94,208 bits (approximately 94 kbits) for distributed and block RAM usage in application buffers and small data stores.
• High I/O Count 206 user I/Os in a 256-ball package enable multiple parallel interfaces and extensive external connectivity.
• Low-Voltage Operation Core supply range of 1.14 V to 1.26 V supports low-power system designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Non-Volatile and Reconfigurable MachXO2 family features include instant-on non-volatile configuration and in-field reconfiguration capabilities (TransFR) with programming options via JTAG, SPI, and I²C.
• Power and I/O Flexibility Family-level low-power architecture (65 nm process) and programmable I/O buffer options for multiple signaling standards and power-saving modes.
• Package and Mounting Surface-mount 256-LBGA / supplier package 256-FTBGA (17×17 mm) for robust board-level integration; RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion High I/O count and flexible I/O standards from the MachXO2 family make this device suitable for bridging multiple serial and parallel interfaces.
• Embedded Control and Glue Logic Approximately 4,320 logic elements and on-chip RAM enable implementing system control logic, sequencing, and peripheral aggregation.
• Display and Memory Interface Support MachXO2 family features include geared display I/O and dedicated DDR/DDR2/LPDDR memory support, useful for display timing and memory interface tasks.
• Industrial Automation Industrial operating temperature range and robust package options fit industrial control, sensor aggregation, and automation I/O applications.

Unique Advantages

• High I/O Density: 206 I/Os in a compact 256-ball BGA allow consolidation of multiple interfaces into a single device, reducing board complexity and BOM count.
• Non-Volatile Instant-On: Family-level instant-on and single-chip configuration simplify system boot and eliminate the need for external configuration PROM in many designs.
• Flexible Power and I/O Options: Low-voltage core operation and programmable I/O buffers support power-sensitive designs and a wide range of signaling standards.
• Field Upgradability: TransFR reconfiguration enables in-field logic updates without full system shutdown, supporting maintenance and iterative upgrades.
• Industrial Robustness: Specified −40 °C to 100 °C operation and surface-mount 256-FTBGA packaging make the device suitable for demanding environments.

Why Choose LCMXO2-4000ZE-3FTG256I?

The LCMXO2-4000ZE-3FTG256I delivers a blend of programmable logic capacity, substantial I/O resources, and embedded memory in an industrial-grade, low-voltage FPGA package. It is positioned for designers who need reconfigurable logic, high connectivity, and on-chip non-volatile configuration within a compact BGA footprint.

As part of the MachXO2 family, this device offers system-level features such as programmable I/O, in-field reconfiguration, and power-saving options that support scalable designs and lifecycle updates while keeping board-level integration straightforward.

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