LCMXO2-4000ZE-3QN84I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 68 94208 4320 84-VFQFN Dual Rows, Exposed Pad |
|---|---|
| Quantity | 1,519 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 84-QFN (7x7) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 84-VFQFN Dual Rows, Exposed Pad | Number of I/O | 68 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-3QN84I – MachXO2 Field Programmable Gate Array (FPGA)
The LCMXO2-4000ZE-3QN84I is a MachXO2-series FPGA in an 84‑QFN (7×7) exposed‑pad package designed for industrial applications. It provides a compact, surface‑mount reconfigurable logic solution combining 4,320 logic elements with on‑chip embedded memory and flexible I/O for control, interface bridging, and system glue logic.
Built for low‑voltage operation and wide operating temperatures, this device targets industrial embedded systems that require non‑volatile configuration, in-field updates, and a small footprint with measurable thermal performance from the exposed pad package.
Key Features
- Core Logic — 4,320 logic elements for implementing custom logic, state machines, and interface glue functions.
- Embedded Memory — Approximately 94 kbits of on‑chip RAM to support FIFOs, buffers, and small data stores for control and buffering tasks.
- I/O Capacity — 68 user I/Os with programmable buffer options to support a wide range of digital interfaces and signaling requirements.
- Non‑volatile Configuration — On‑chip user flash memory and support for background programming and multi‑mode configuration for instant‑on and reconfiguration workflows (family feature).
- Clocking and PLLs — Flexible on‑chip clocking with dedicated PLL resources for system clock generation and synchronization (family feature).
- Low‑Voltage Supply — Operates from a single core supply range of 1.14 V to 1.26 V to support low‑power system designs.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- Compact Package — 84‑VFQFN dual rows with exposed pad, surface‑mount package (84‑QFN, 7×7 mm footprint) for small PCBs and improved thermal dissipation.
- Standards and Compliance — RoHS compliant for lead‑free manufacturing.
Typical Applications
- Industrial Control — Implement real‑time control logic, signal conditioning, and interface translation in factory automation and process equipment.
- Interface Bridging — Bridge and glue heterogeneous peripherals and MCUs where customizable I/O and protocol adaptation are required.
- Embedded System Glue — Offload timing-critical state machines and peripheral management from a main processor to reduce system complexity.
- Display and Memory Interfaces — Support for source‑synchronous and DDR‑style I/O (family feature) enables use in display timing and high‑speed interface buffering.
Unique Advantages
- Compact, thermally mindful package: The 84‑VFQFN with exposed pad delivers a small board footprint while aiding heat dissipation for continuous industrial operation.
- Right‑sized logic and memory: 4,320 logic elements paired with approximately 94 kbits of RAM provide a balanced platform for mid‑density logic and buffering needs without overprovisioning.
- Flexible interfaces: 68 configurable I/Os and family‑level programmable I/O standards enable adaptation to diverse peripherals and signaling levels.
- Industrial operating range: Rated −40 °C to 100 °C to meet common industrial deployment requirements.
- Low‑voltage core: Narrow core supply range (1.14 V–1.26 V) supports integration into low‑power system power rails.
- Non‑volatile, reconfigurable: On‑chip flash and family features such as background programming and in‑field reconfiguration support iterative development and field updates.
Why Choose LCMXO2-4000ZE-3QN84I?
This MachXO2 device is positioned for industrial embedded designs that need a compact, reconfigurable logic element with balanced on‑chip memory and substantial I/O capacity. Its combination of 4,320 logic elements, approximately 94 kbits of embedded RAM, and an exposed‑pad 84‑QFN package makes it well suited for space‑constrained systems requiring robust thermal performance and in‑field update capability.
Designers focused on interface adaptation, control logic offload, or compact system glue functions will find this device provides reliable operation across a wide temperature range, low‑voltage core compatibility, and the non‑volatile configuration features needed for maintainable, field‑serviced products.
Request a quote or submit an inquiry to receive pricing and lead‑time information for the LCMXO2-4000ZE-3QN84I. Our team can provide availability details and help evaluate the device for your design requirements.

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