LCMXO2-4000ZE-3TG144I

The LCMXO2-4000ZE-3TG144I is a MachXO2 field programmable gate array (FPGA) optimized for low-power, instant-on system control and I/O expansion. Built on the MachXO2 family architecture, it combines reconfigurable logic, embedded memory, flexible I/O and non-volatile configuration to address control, glue-logic and interface tasks across industrial designs.

With 4,320 logic elements, approximately 94 kbits of on-chip memory, and 114 I/Os in a 144-pin LQFP package, this device targets applications requiring compact packaging, low standby power and a wide operating temperature range.

Key Features

• Logic Capacity — 4,320 logic elements to implement glue logic, control functions and custom peripherals.
• Embedded Memory — Total on-chip RAM of 94,208 bits (approximately 92 kbits) for distributed storage and small buffers.
• I/O Count & Flexibility — 114 general-purpose I/Os in a 144-LQFP package, supporting a variety of board-level interfacing needs.
• Non-Volatile, Instant-On Configuration — MachXO2 family supports single-chip non-volatile configuration with instant-on behavior and background programming options.
• Low Power Architecture — Family-level low-power features include ultra-low standby power options and programmable I/O terminations to reduce system power.
• On-Chip Peripherals — Hardened functions available in the family such as SPI, I2C and timer/counter for common system tasks and peripheral control.
• Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs (family capability) supporting a wide input frequency range.
• Package & Mounting — 144-LQFP (20 × 20 mm) surface-mount package for compact PCB implementations; RoHS compliant.
• Voltage & Temperature — Supply range 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C.

Typical Applications

• System Glue Logic — Replace discrete logic with a reconfigurable device to consolidate board-level control, protocol translation and timing glue.
• Interface Bridging — Implement SPI/I2C bridges, custom UARTs or parallel-to-serial conversions using built-in interface support and flexible I/Os.
• Display and Memory Interfaces — Pre-engineered source-synchronous I/O and display gearing in the family simplify display timing and DDR-style interfaces.
• Industrial Control — Industrial-grade temperature rating and robust I/O count make the device suitable for sensor aggregation, motor/IO control and embedded monitoring functions.

Unique Advantages

• Compact, High-IO Package: 114 I/Os in a 144-LQFP enable dense connectivity while maintaining a small PCB footprint.
• Non-Volatile, Instant-On: Single-chip configuration eliminates external configuration memory and enables fast system startup.
• Embedded Memory for Local Storage: Approximately 92 kbits of on-chip RAM reduces dependence on external SRAM for small buffers and FIFOs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to meet a wide range of environmental requirements.
• Flexible Peripheral Support: On-chip SPI, I2C and timer/counter functions accelerate common system tasks and reduce BOM.
• Low Power Options: Family-level low-power features and programmable I/O terminations help minimize standby and active power consumption.

Why Choose LCMXO2-4000ZE-3TG144I?

The LCMXO2-4000ZE-3TG144I positions itself as a versatile, industrial-grade FPGA for designers needing a balanced combination of logic capacity, embedded memory and broad I/O in a compact LQFP package. Its non-volatile configuration, flexible on-chip peripherals and family-provided low-power options make it well suited for system control, interface bridging and display/memory timing tasks.

This device is ideal for teams looking to reduce board complexity, accelerate time-to-market with on-chip peripherals and maintain reliable operation across a wide temperature range while keeping a compact form factor.

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