LCMXO2-4000ZE-3QN84C

The LCMXO2-4000ZE-3QN84C is a MachXO2 family field programmable gate array (FPGA) in a compact 84‑QFN (7×7) package with exposed pad. It provides 4,320 logic elements and 68 I/Os for low‑power embedded logic, interface bridging and system glue applications where a small footprint and non‑volatile configuration are required. The device operates over a commercial temperature range of 0°C to 85°C and uses a core supply between 1.14 V and 1.26 V.

Key Features

• Logic Capacity — 4,320 logic elements to implement glue logic, control functions and moderate-density FPGA designs.
• On‑chip Memory — Approximately 94,208 bits of total RAM for distributed storage and buffering within user logic.
• I/O Count & Flexibility — 68 I/Os in the 84‑QFN package, supporting a wide range of interfaces and in small form factors.
• Low Power Architecture — MachXO2 family features ultra low power operation with standby levels as low as tens of microwatts and selectable power saving modes.
• Non‑volatile Configuration — Instant‑on, single‑chip non‑volatile configuration with in‑field reconfiguration capability for firmware updates while deployed.
• Embedded Peripherals — Family includes hardened functions such as SPI, I2C and timer/counter for common system tasks (series-level feature).
• Clocking — Flexible on‑chip clocking including primary clocks and up to two analog PLLs (series-level feature).
• Package & Mounting — Surface‑mount 84‑VFQFN dual rows with exposed pad (supplier device package: 84‑QFN 7×7) for compact board integration.
• Compliance & Environmental — RoHS compliant.
• Operating Range — Commercial grade operation from 0°C to 85°C and specified core voltage range 1.14 V to 1.26 V.

Typical Applications

• Interface Bridging and Glue Logic — Use the device to implement protocol conversion, bus bridging and board‑level glue where compact, reprogrammable logic is required.
• Memory Interface Control — Family support for dedicated DDR/DDR2/LPDDR memory interfaces and source synchronous I/O makes it suitable for memory‑controller glue and timing support in designs (series‑level capability).
• Firmware Upgrades and Field Updates — Non‑volatile configuration and in‑field reconfiguration enable remote firmware updates and iterative system improvements without hardware changes.
• Peripheral Offload and I/O Aggregation — Hardened I2C/SPI and flexible I/O options allow the FPGA to offload simple control tasks and aggregate peripherals into a single device.

Unique Advantages

• Compact, High‑density Logic: 4,320 logic elements in a 7×7 QFN package reduce board space while providing significant programmable capacity.
• Flexible Embedded Memory: Approximately 94 kbits of on‑chip RAM supports local buffering and state storage without external SRAM.
• Low Power Operation: MachXO2 family low standby consumption conserves power in battery‑sensitive or always‑on systems.
• Instant‑On Non‑volatile Configuration: Powers up in microseconds and retains configuration without external flash, simplifying system boot behavior.
• Rich System Integration: Hardened SPI, I2C and timer/counter functions reduce firmware overhead and minimize external components.
• Small Package, Robust Connectivity: 68 I/Os in an 84‑QFN with exposed pad enable dense I/O mapping and thermal management in compact designs.

Why Choose LCMXO2-4000ZE-3QN84C?

This MachXO2 device balances moderate logic capacity and flexible I/O in a compact, low‑power package suited for commercial‑grade embedded designs. Its non‑volatile instant‑on behavior, on‑chip RAM, and family‑level peripherals (SPI, I2C, timers) make it a practical choice when board area, power and reconfigurability are priorities. The device supports density migration within the MachXO2 family and includes series features that simplify memory interfaces and in‑field updates, delivering long‑term design flexibility and reduced BOM complexity.

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