LCMXO2-4000ZE-3FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 51 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000ZE-3FTG256C – MachXO2 FPGA, 206 I/Os, ~4320 Logic Elements, 256-LBGA
The LCMXO2-4000ZE-3FTG256C is a MachXO2 family field programmable gate array (FPGA) in a 256-ball ftBGA package designed for commercial embedded designs. This device combines flexible logic resources with a broad I/O set and on-chip non‑volatile features to address control, interface, and system integration roles.
With approximately 4320 logic elements, roughly 94 kbits of total RAM, 206 I/Os and single-supply operation in the 1.14 V to 1.26 V range, the part targets applications that require a compact, low-power, reconfigurable building block with rich I/O and system-level support.
Key Features
- Core / Logic: Approximately 4320 logic elements for implementing glue logic, protocol handling and moderate-density state machines.
- Memory: Approximately 94,208 bits of total RAM on-chip; MachXO2 family devices also include embedded block RAM and distributed RAM options at the series level.
- I/O and Interfaces: 206 user I/Os in a 256-ball ftBGA package. Series-level sysIO buffer support and programmable I/O allow a wide range of interface options and on-chip differential termination.
- Power and Voltage: Single-supply operation with specified voltage supply range of 1.14 V to 1.26 V and low-power family characteristics at the series level.
- Clocking and PLLs: Series-level support for multiple primary clocks and up to two analog PLLs for flexible clock generation and high-speed I/O timing.
- Non-volatile Configuration & Reconfiguration: MachXO2 family offers on-chip user flash and instant-on reconfigurability with background programming and in-field logic update capability.
- System-level Functions: Hardened SPI, I²C, timer/counter and on-chip oscillator available at the family level to simplify system integration.
- Package and Thermal: 256-FTBGA (17 mm × 17 mm) surface-mount package; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.
Typical Applications
- Display and Video Interfaces: Use the device’s pre‑engineered source synchronous I/O and display gearing capabilities (series-level) for driving and bridging display interfaces.
- Interface Bridging and Protocol Conversion: Implement protocol translation, bus bridging and glue logic between system components using the device’s abundant I/O and programmable logic.
- Embedded Control and System Glue: Integrate peripheral control, timers and simple state machines while leveraging on-chip non‑volatile configuration for instant-on behavior.
- Memory PHY and DDR Support: Leverage the series-level DDR/DDR2/LPDDR memory interface features for designs requiring dedicated memory PHY support.
Unique Advantages
- Broad I/O Count: 206 I/Os in a compact 256-ball ftBGA package provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
- Balanced Logic and Memory: Approximately 4320 logic elements and ~94 kbits of RAM enable implementation of control, interfacing, and buffering functions in a single device.
- Non-volatile and Reconfigurable: MachXO2 family non-volatile configuration and TransFR reconfiguration allow in-field updates and instant-on system behavior.
- Integrated System Functions: On-chip SPI, I²C, timers and oscillator reduce external component count and simplify board-level design.
- Low-power Family Characteristics: Series-level low-power process and standby options support energy-conscious designs.
Why Choose LCMXO2-4000ZE-3FTG256C?
This MachXO2 device offers a practical balance of logic density, embedded memory and a large, flexible I/O count in a 256-ball ftBGA footprint. It is suited for teams needing a non-volatile, reconfigurable FPGA that consolidates interface, control and system-support functions into a single component while operating within commercial temperature and voltage ranges.
Choose this part for compact, low-power applications that benefit from integrated system-level features and the series’ reconfiguration capabilities—enabling simplified BOM, faster system bring-up and field-updatable designs.
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