LCMXO2-4000ZE-3FTG256C

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA

Quantity 51 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000ZE-3FTG256C – MachXO2 FPGA, 206 I/Os, ~4320 Logic Elements, 256-LBGA

The LCMXO2-4000ZE-3FTG256C is a MachXO2 family field programmable gate array (FPGA) in a 256-ball ftBGA package designed for commercial embedded designs. This device combines flexible logic resources with a broad I/O set and on-chip non‑volatile features to address control, interface, and system integration roles.

With approximately 4320 logic elements, roughly 94 kbits of total RAM, 206 I/Os and single-supply operation in the 1.14 V to 1.26 V range, the part targets applications that require a compact, low-power, reconfigurable building block with rich I/O and system-level support.

Key Features

  • Core / Logic: Approximately 4320 logic elements for implementing glue logic, protocol handling and moderate-density state machines.
  • Memory: Approximately 94,208 bits of total RAM on-chip; MachXO2 family devices also include embedded block RAM and distributed RAM options at the series level.
  • I/O and Interfaces: 206 user I/Os in a 256-ball ftBGA package. Series-level sysIO buffer support and programmable I/O allow a wide range of interface options and on-chip differential termination.
  • Power and Voltage: Single-supply operation with specified voltage supply range of 1.14 V to 1.26 V and low-power family characteristics at the series level.
  • Clocking and PLLs: Series-level support for multiple primary clocks and up to two analog PLLs for flexible clock generation and high-speed I/O timing.
  • Non-volatile Configuration & Reconfiguration: MachXO2 family offers on-chip user flash and instant-on reconfigurability with background programming and in-field logic update capability.
  • System-level Functions: Hardened SPI, I²C, timer/counter and on-chip oscillator available at the family level to simplify system integration.
  • Package and Thermal: 256-FTBGA (17 mm × 17 mm) surface-mount package; commercial operating temperature range 0 °C to 85 °C. RoHS compliant.

Typical Applications

  • Display and Video Interfaces: Use the device’s pre‑engineered source synchronous I/O and display gearing capabilities (series-level) for driving and bridging display interfaces.
  • Interface Bridging and Protocol Conversion: Implement protocol translation, bus bridging and glue logic between system components using the device’s abundant I/O and programmable logic.
  • Embedded Control and System Glue: Integrate peripheral control, timers and simple state machines while leveraging on-chip non‑volatile configuration for instant-on behavior.
  • Memory PHY and DDR Support: Leverage the series-level DDR/DDR2/LPDDR memory interface features for designs requiring dedicated memory PHY support.

Unique Advantages

  • Broad I/O Count: 206 I/Os in a compact 256-ball ftBGA package provide flexibility to connect multiple peripherals and interfaces without external multiplexing.
  • Balanced Logic and Memory: Approximately 4320 logic elements and ~94 kbits of RAM enable implementation of control, interfacing, and buffering functions in a single device.
  • Non-volatile and Reconfigurable: MachXO2 family non-volatile configuration and TransFR reconfiguration allow in-field updates and instant-on system behavior.
  • Integrated System Functions: On-chip SPI, I²C, timers and oscillator reduce external component count and simplify board-level design.
  • Low-power Family Characteristics: Series-level low-power process and standby options support energy-conscious designs.

Why Choose LCMXO2-4000ZE-3FTG256C?

This MachXO2 device offers a practical balance of logic density, embedded memory and a large, flexible I/O count in a 256-ball ftBGA footprint. It is suited for teams needing a non-volatile, reconfigurable FPGA that consolidates interface, control and system-support functions into a single component while operating within commercial temperature and voltage ranges.

Choose this part for compact, low-power applications that benefit from integrated system-level features and the series’ reconfiguration capabilities—enabling simplified BOM, faster system bring-up and field-updatable designs.

Request a quote or submit an inquiry to receive pricing and availability information for LCMXO2-4000ZE-3FTG256C.

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