LCMXO2-4000ZE-3FG484I

The LCMXO2-4000ZE-3FG484I is a MachXO2 family FPGA from Lattice Semiconductor, offering a flexible logic architecture in an industrial-grade, surface-mount package. This device provides 4,320 logic elements, up to 278 I/Os and embedded memory resources suitable for glue logic, I/O expansion and mid-density programmable logic tasks.

Designed for low-voltage operation (1.14 V to 1.26 V) and rated for extended temperature operation (−40 °C to 100 °C), the device targets applications that require broad I/O capability, non-volatile configuration and low standby power in a compact 484-ball BGA footprint.

Key Features

• Core Logic — 4,320 logic elements (cells) for implementing custom combinational and sequential logic functions.
• Embedded Memory — 94,208 total RAM bits (approximately 0.094 Mbits) of on-chip memory for FIFOs, buffering and small data stores.
• High I/O Count — Up to 278 I/Os to support wide parallel interfaces, board-level glue logic and multiple peripheral connections.
• Low-Voltage Supply — Operates from 1.14 V to 1.26 V, enabling integration into low-voltage system domains.
• Industrial Temperature Range — Rated for −40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — 484-ball BGA package (supplier device package listed as 484-FBGA, 23 × 23 mm) with surface-mount mounting for compact board designs.
• Non-volatile and Reconfigurable Family Features — MachXO2 family-level capabilities include non-volatile, instant-on configuration, background programming and in-field reconfiguration options (family datasheet).
• Compliance — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• System Glue and Control — Use the device to consolidate discrete logic, manage board-level sequencing and implement custom control logic leveraging on-chip logic elements and embedded memory.
• Interface Expansion — Leverage up to 278 I/Os for parallel/serial interface bridging, protocol adaptation and peripheral aggregation.
• Memory and Data Buffering — Implement FIFO and buffer functions using the device’s embedded RAM for temporary storage in data paths and buffering applications.
• Industrial Embedded Systems — The industrial operating temperature range and surface-mount BGA package make the device suitable for industrial instrumentation and control modules.

Unique Advantages

• Balanced Logic and I/O Capacity: 4,320 logic elements combined with 278 I/Os provide a strong balance for mid-density designs that require significant external connectivity.
• Compact, High-Density Packaging: The 484-ball BGA (23 × 23 mm) package delivers high I/O in a compact footprint for space-constrained boards.
• Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) helps integration into low-voltage system rails and modern power architectures.
• Industrial Reliability: Rated for −40 °C to 100 °C to address harsher operating environments without additional qualification claims beyond the provided grade.
• RoHS Compliance: Meets environmental manufacturing requirements to support modern product lifecycles.

Why Choose LCMXO2-4000ZE-3FG484I?

The LCMXO2-4000ZE-3FG484I positions itself as an industrial-grade, mid-density FPGA offering a practical mix of logic, embedded memory and extensive I/O in a single compact BGA package. Its low-voltage operation and family-level features for non-volatile configuration and in-field reconfiguration make it suitable for designs that require reliable, reprogrammable logic and broad interface support.

This device is well suited for engineers building control modules, I/O expanders and system glue logic where a balance of logic capacity, I/O count and industrial temperature performance delivers long-term value through a scalable and reconfigurable platform.

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