LCMXO2-4000ZE-3BG332I

The LCMXO2-4000ZE-3BG332I is a MachXO2 family Field Programmable Gate Array (FPGA) offered in a 332-ball FBGA package. It combines a flexible low-power logic architecture with abundant I/O and on-chip memory to address industrial control, interface bridging and display or memory interface applications.

With 4,320 logic elements, approximately 94 kbits of on-chip RAM, and 274 I/Os in a compact 17 mm × 17 mm BGA footprint, this device delivers a balanced mix of integration, I/O density and power efficiency for space-constrained systems operating across an extended industrial temperature range.

Key Features

• Logic Capacity — 4,320 logic elements appropriate for glue logic, control functions and moderate combinational/sequential logic integration.
• Embedded Memory — Approximately 94,208 bits (≈94 kbits) of on-chip RAM to support FIFOs, buffering and small data storage needs.
• High I/O Density — 274 user I/Os delivered in a 332-ball package, enabling multiple interfaces and parallel connectivity in a single device.
• Low-Voltage Core — Core supply range from 1.14 V to 1.26 V to match low-power system rails.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 332-FBGA package case with supplier device package listed as 332-CABGA (17 × 17 mm); surface-mount mounting for PCB assembly.
• Non-volatile Configuration & Family Capabilities — MachXO2 family features include on-chip user flash memory, instant-on configuration and in-field reconfiguration options (family-level).
• Power & Low-Power Options — Family-level ultra low power architecture (advanced 65 nm) and standby modes reduce system idle power (family-level capability).
• System Functions (Family) — The MachXO2 family provides programmable sysIO buffers, PLLs, on-chip oscillator, and hardened interfaces such as SPI and I²C for system-level integration (family-level features).
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control — Implement sensor aggregation, GPIO expansion and deterministic glue logic while meeting extended temperature requirements for factory and process control equipment.
• Interface Bridging — Bridge between multiple parallel and serial buses using the device’s high I/O count and on-chip memory for buffering and alignment.
• Display and User Interface Control — Drive and manage display timing, panel interfaces or human-machine interfaces leveraging the device’s I/O density and family-level source-synchronous I/O features.
• Memory and Peripheral Timing — Support small FIFOs, clocking alignment and protocol conversion for external memory or peripheral interfaces using embedded RAM and clocking resources.

Unique Advantages

• High I/O in a Compact Footprint: 274 I/Os in a 332-ball BGA package enable complex connectivity without increasing board area.
• Integrated Logic and RAM: 4,320 logic elements with approximately 94 kbits of on-chip RAM reduce the need for external components for buffering and control logic.
• Industrial Robustness: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Low-Voltage Operation: Narrow core supply range (1.14 V–1.26 V) suits low-power system designs and modern regulator architectures.
• Non-volatile Configuration Options (Family): MachXO2 family instant-on and on-chip flash capabilities simplify boot profiles and support in-field updates.
• RoHS Compliance: Environmentally compliant packaging supports regulatory and supply-chain requirements.

Why Choose LCMXO2-4000ZE-3BG332I?

The LCMXO2-4000ZE-3BG332I delivers a practical combination of logic density, on-chip memory and exceptional I/O capacity in a surface-mount 332-ball BGA package tailored for industrial applications. Its low-voltage core and family-level low-power features make it suitable for systems where power efficiency and fast, deterministic start-up are important.

Choose this device when your design requires a reconfigurable, RoHS-compliant FPGA with substantial I/O and embedded RAM to consolidate glue logic, interface conversion and control functions while maintaining industrial thermal performance and compact PCB footprint.

Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-4000ZE-3BG332I. Technical sales and product specialists can provide lead-time, volume pricing and integration support tailored to your project requirements.