LCMXO2-4000ZE-3MG132C

The LCMXO2-4000ZE-3MG132C is a MachXO2 family Field Programmable Gate Array (FPGA) IC designed for instant-on, non-volatile logic integration. It combines a flexible logic fabric with embedded memory and programmable I/O to support interface bridging, control logic, and system integration tasks in commercial-grade applications.

Built on MachXO2 family architecture, this device targets designs that require low-power standby behavior, in-field reconfiguration, and a compact CSPBGA package while providing up to 104 general-purpose I/Os and a broad on-chip feature set.

Key Features

• Logic Capacity — 540 CLBs delivering 4,320 logic elements suitable for glue logic, protocol adaptation, and mid-density control functions.
• On-chip Memory — 94,208 total RAM bits of embedded memory (approximately 0.094 Mbits) for distributed storage and small FIFOs.
• I/O Count & Flexibility — 104 I/Os in a compact package; family I/O support includes a wide range of standards such as LVCMOS, LVDS, and programmable differential interfaces (as provided by the MachXO2 family).
• Non-volatile, Reconfigurable — MachXO2 family supports on-chip user flash memory and instant-on, with in-field logic update (TransFR) capabilities for firmware and logic upgrades without external volatile configuration.
• Power & Voltage — Single-supply operation with a device supply range of 1.14 V to 1.26 V, and family-level low-power options including very low standby power modes.
• Clocking & PLLs — Family-level support for multiple primary clocks and up to two PLLs for fractional-n frequency synthesis and flexible clock management.
• Package — 132‑LFBGA (132‑CSPBGA, 8×8) package for a small board footprint and high I/O density.
• Operating Range & Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Interface Bridging — Use as protocol glue between different serial or parallel buses, taking advantage of programmable I/O and embedded memory for buffering.
• System Control & Glue Logic — Implement startup sequencing, power-management control, and peripheral coordination leveraging non-volatile configuration and instant-on behavior.
• In-field Upgradeable Logic — Deploy systems that require field updates to FPGA logic while maintaining system operation using the MachXO2 family’s TransFR reconfiguration capability.
• Display and DDR Support — Useful in designs that require source-synchronous I/O or DDR interfacing features provided within the MachXO2 family architecture.

Unique Advantages

• Integrated Non-Volatile Configuration: Instant-on capability and on-chip user flash memory remove the need for external configuration PROMs, simplifying BOM and board layout.
• Compact, High-Density Package: 132‑LFBGA (8×8 CSPBGA) delivers 104 I/Os and mid-range logic density in a small footprint for space-constrained designs.
• In-field Reconfiguration: TransFR enables safe, background updates to logic while the system remains operational, reducing maintenance windows.
• Low-Voltage Single-Supply Operation: Narrow supply range (1.14 V–1.26 V) supports systems designed around low-voltage rails and reduces power-supply complexity.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, appropriate for a broad set of commercial and consumer electronics applications.

Why Choose LCMXO2-4000ZE-3MG132C?

This MachXO2 device balances mid-range logic capacity (4,320 logic elements) with a rich set of family-level features—embedded RAM, non-volatile configuration, programmable I/O, and reconfiguration capabilities—making it an efficient choice for system integration tasks, interface bridging, and in-field-upgradeable designs. Its compact 132‑LFBGA package and 104 I/Os fit well in space-constrained board layouts while preserving flexibility for diverse I/O standards.

Designers seeking a commercial-grade, low-power FPGA with instant-on behavior and on-chip memory will find the LCMXO2-4000ZE-3MG132C well suited to reduce component count, simplify system architecture, and support long-term firmware and logic evolution through in-field updates.

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