LCMXO640C-4FTN256C

The LCMXO640C-4FTN256C is a MachXO family FPGA IC from Lattice Semiconductor designed for instant-on, non-volatile logic integration. With 640 logic elements and 159 I/O pins in a 256-ball BGA package, it addresses glue logic, bus bridging, power-up control and other system-control functions where compact, reconfigurable logic is required.

Built on the MachXO architecture, this device combines non-volatile configuration, flexible programmable I/O and in-field reconfiguration capabilities to simplify board-level design and accelerate system bring-up.

Key Features

• Core Logic – 640 logic elements (LUTs) for implementing glue logic, control state machines and interface adaptation.
• I/O Density – 159 programmable I/Os provided in the 256-ball package to support high pin-to-logic connectivity in compact form factors.
• Non-volatile, Instant-On Configuration – Single-chip non-volatile configuration allows the device to power up in microseconds without external configuration memory.
• Reconfiguration and Field Updates – Supports in-field reconfiguration (TransFR™) and background programming of non-volatile memory for fast updates while the system operates.
• Embedded and Distributed Memory – Distributed RAM resources (family data indicates approximately 6.1 Kbits of distributed RAM for this density) to support small FIFOs and buffering needs.
• Flexible sysIO™ Buffering – Family I/O support for a wide range of interfaces including multiple LVCMOS voltage levels and several differential standards, enabling interface consolidation (refer to MachXO family details for supported standards).
• Low-Power Modes – Sleep mode can significantly reduce static current (family data cites up to 100× static current reduction), useful for power-sensitive applications.
• Power and Mounting – Operates across a supply range of 1.71 V to 3.465 V and is supplied in a surface-mount 256-LBGA package (supplier package: 256-FTBGA, 17×17 mm).
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation, suitable for commercial embedded applications.

Typical Applications

• Glue Logic & System Control – Implement board-level glue logic, power-up sequencing and system control functions with fast, non-volatile startup.
• Bus Bridging & Interface Conversion – Bridge legacy and modern buses or adapt signal standards using the device’s flexible I/O and routing resources.
• Power Management – Use for power sequencing and supervision tasks where deterministic startup and small control logic are required.
• User Interface & Peripherals – Manage LED/IO expansion, button scanning and peripheral control with compact programmable logic and ample I/O.

Unique Advantages

• Instant-On, Single-Chip Solution: Non-volatile configuration eliminates the need for external configuration memory and delivers microsecond startup.
• High Pin-to-Logic Ratio: 159 I/Os matched to 640 logic elements enables dense I/O-driven designs without large FPGA footprints.
• Field Update Capability: TransFR reconfiguration and background programming let you update logic in-field with minimal system disruption.
• Flexible Interface Support: Programmable I/O buffers accommodate multiple voltage standards and differential interfaces to reduce board-level interface components.
• Compact, Surface-Mount Package: 256-ball BGA (17×17 mm supplier package) provides a small board footprint while supporting a high I/O count.
• Commercial Temperature & Voltage Range: Operates from 0 °C to 85 °C and across 1.71 V–3.465 V supply ranges for a broad set of embedded applications.

Why Choose LCMXO640C-4FTN256C?

The LCMXO640C-4FTN256C positions itself as a practical, compact FPGA for designs that require non-volatile, instant-on logic and significant I/O density. Its MachXO family capability for in-field reconfiguration, flexible sysIO buffering and distributed memory make it well suited to system-control, interface bridging and power-management roles where predictable startup and updateability matter.

Supported by MachXO family design flows, the device provides an efficient path to reduce BOM complexity and accelerate development for commercial embedded products that need reliable, reconfigurable logic in a small package.

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