LCMXO640C-4FT256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 201 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-4FT256I – MachXO FPGA, 640 logic elements, 159 I/Os, 256-FTBGA
The LCMXO640C-4FT256I is a MachXO family Field Programmable Gate Array (FPGA) in a 256-ball ftBGA (17×17) package, offering approximately 640 logic elements and up to 159 I/Os in a single, non-volatile device. It targets applications that require glue logic, bus interfacing, power-up control and other system control functions where instant-on behavior and reconfigurability are valuable.
Designed for industrial use, the device supports a wide supply range and extended temperature operation, delivering board-level integration and design flexibility for control, bridging and interface tasks in embedded systems.
Key Features
- Core Logic Approximately 640 logic elements (LUT-based architecture) suitable for implementing glue logic, bus bridging and control tasks.
- I/O Density Up to 159 I/Os in the 256-ball ftBGA package, enabling high pin-to-pin connectivity for complex interfacing.
- Non-volatile, Instant-on MachXO family characteristics include single-chip non-volatile configuration and instant-on operation without external configuration memory.
- In-field Reconfiguration Supports background programming and TransFR reconfiguration for in-field logic updates while the system operates.
- Memory Family data indicates distributed RAM capability (LCMXO640: approximately 6.1 Kbits distributed RAM) for small embedded storage and FIFO control logic; this part provides the MachXO family memory architecture.
- Flexible I/O Standards MachXO family sysIO buffering supports multiple interface standards (examples listed in family datasheet include LVCMOS, LVTTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS), enabling a wide range of signaling options.
- Voltage Supply Specifies operation across a broad supply range from 1.71 V to 3.465 V for flexible system integration.
- Packaging & Mounting 256-ball ftBGA (17×17 mm) package, surface-mount mounting type for compact board designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for use in industrial environments.
- Low-Power Modes MachXO family features include a sleep mode that allows substantial static current reduction for low-power standby operation.
Typical Applications
- Glue Logic and System Control Implement glue logic, power-up sequencing and control-state machines without external configuration devices thanks to the device’s non-volatile architecture.
- Bus Bridging and Interfacing High I/O count and flexible I/O buffer options make the device suitable for bridging between different bus standards and signal domains.
- Embedded Control Use in control logic for industrial equipment, managing peripheral interfaces and board-level sequencing within extended temperature ranges.
- In-field Upgrades Background programming and TransFR reconfiguration enable field updates to control logic while the system remains operational.
Unique Advantages
- Single-chip, non-volatile configuration: Eliminates the need for external configuration memory and provides instant-on system behavior.
- High pin-to-function ratio: 159 I/Os combined with ~640 logic elements delivers strong connectivity for dense interfacing tasks without large FPGA overhead.
- Wide supply and temperature range: 1.71 V–3.465 V operation and −40 °C to 100 °C rating support robust integration into industrial systems.
- Field reprogrammability: Supports background programming and in-field TransFR updates to enable incremental feature upgrades and bug fixes.
- Compact BGA package: 256-ball ftBGA (17×17) allows a high I/O count in a small footprint for space-constrained boards.
- Toolchain and ecosystem support: The MachXO family is supported by ispLEVER design tools for synthesis, place-and-route and timing analysis to streamline development.
Why Choose LCMXO640C-4FT256I?
The LCMXO640C-4FT256I positions MachXO family capability—non-volatile instant-on configuration, in-field reconfiguration and a favorable I/O-to-logic ratio—into a compact, industrial-grade ftBGA package. It is suited for engineers who need reliable, reprogrammable control and interfacing functionality without the overhead of large FPGAs or external configuration devices.
For teams building bus bridges, power controllers, glue logic or embedded control functions, this device offers a balanced combination of connectivity, reconfigurability and industrial operating range, backed by the MachXO family design ecosystem.
Request a quote or submit a parts inquiry to get pricing, availability and lead-time information for the LCMXO640C-4FT256I.

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