LCMXO640C-4FT256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LBGA |
|---|---|
| Quantity | 1,051 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-4FT256C – MachXO Field Programmable Gate Array (FPGA) IC, 159 I/Os, 640 logic elements, 256-LBGA
The LCMXO640C-4FT256C is a MachXO family non-volatile FPGA delivering 640 logic elements and up to 159 user I/Os in a compact 256-ball BGA package. It is designed for glue logic, bus bridging, interface control and general system control tasks where instant-on operation and single-chip integration are important.
Built on the MachXO family architecture, the device provides single-chip instant-on behavior with background configuration and in-field reconfiguration capabilities, enabling reduced system BOM and fast system startup for commercial-temperature embedded designs.
Key Features
- Core Logic — 640 logic elements implemented across 80 logic blocks, enabling mid-density logic integration for control and interface functions.
- Non-volatile, Instant-On Architecture — MachXO family single-chip non-volatile architecture provides instant-on power-up in microseconds without external configuration memory.
- In-field Reconfiguration and Programming — Supports TransFR reconfiguration and reconfiguration of SRAM-based logic in milliseconds; non-volatile memory and SRAM are programmable through JTAG and support background programming (family-level capability).
- Memory — Approximately 6.1 Kbits of distributed RAM (family data for LCMXO640 devices) and no embedded block SRAM blocks specified for this density level.
- I/O Capacity and Flexibility — Up to 159 I/Os in the 256-ball package, suitable for multi-interface glue logic and bus interfacing roles.
- Power and Supply Range — Operates across a broad supply range from 1.71 V to 3.465 V to accommodate mixed-voltage designs.
- Low-Power Modes — Family supports a Sleep Mode to reduce static current consumption significantly (family-level capability).
- Package and Mounting — 256-LBGA surface-mount package; supplier device package specified as 256-FTBGA (17×17 mm) for compact board integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial applications.
- RoHS Compliant — Environmental compliance for lead-free assembly.
Typical Applications
- Glue Logic and System Control — Replace discrete logic and simplify board-level control with compact, single-chip programmable logic.
- Bus Bridging and Interface Conversion — Implement bus interfacing and protocol translation functions leveraging the device's I/O count and programmable logic.
- Power-Up and Reset Control — Use instant-on capabilities and non-volatile configuration to manage system power sequencing and deterministic startup behavior.
- Peripheral and Sensor Interfacing — Aggregate and condition multiple signals for microcontrollers or SoCs using available I/Os and distributed memory.
Unique Advantages
- Single-Chip Non-Volatile Solution: Eliminates external configuration memory and enables instant-on operation, simplifying system design and improving boot determinism.
- Balanced I/O-to-Logic Density: 159 I/Os with 640 logic elements supports complex interfacing tasks without excessive device overhead.
- Compact, Surface-Mount Package: 256-ball ftBGA (17×17 mm) package enables high pin-count routing in a small PCB footprint for space-constrained designs.
- Flexible Supply Range: 1.71 V–3.465 V operation supports mixed-voltage systems and eases integration into existing power architectures.
- Design Tool Support: MachXO devices are supported by the vendor’s design tools (ispLEVER noted in family documentation), enabling synthesis, place-and-route, and timing verification workflows.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C for a wide range of commercial embedded applications.
Why Choose LCMXO640C-4FT256C?
The LCMXO640C-4FT256C positions itself as a versatile, mid-density MachXO family device that combines non-volatile instant-on behavior with a high I/O count and compact BGA packaging. It is well suited for engineers who need reliable glue logic, bus interfacing, and system control in commercial-temperature platforms while minimizing BOM and supporting fast system startup.
With support from the MachXO family toolchain and the ability to perform in-field reconfiguration and background programming, this device provides a practical, scalable option for embedded designers focused on integration, predictable power-up, and flexible I/O implementations.
Request a quote or submit a product inquiry today to evaluate the LCMXO640C-4FT256C for your next embedded or interface design.