LCMXO640C-4BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 591 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-4BN256C – MachXO FPGA, 640 logic elements, 159 I/Os, 256-LFBGA (CSPBGA)
The LCMXO640C-4BN256C is a MachXO family non-volatile FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines instant-on non-volatile configuration with a compact logic fabric—640 logic elements and up to 159 I/Os—delivered in a 256-ball LFBGA/CSPBGA package for space-efficient surface-mount designs.
Designed for commercial applications, this device offers field reconfiguration, low-power sleep capability and flexible I/O support across a wide supply voltage range, enabling fast system startup and simplified board-level integration.
Key Features
- Core Logic — 640 logic elements (LUT-based) with 80 logic blocks (CLBs) to implement glue logic, control state machines and interface glue.
- I/O Density — Up to 159 user I/Os in the 256-ball package, enabling high pin-to-logic connectivity for complex interface and bridging tasks.
- Embedded Memory — Approximately 6.1 Kbits of distributed RAM (MachXO family data) and no embedded block SRAM (EBR) for small data buffering and distributed storage.
- Non-volatile, Instant-On — Single-chip non-volatile architecture provides immediate configuration at power-up without external memory (MachXO family behavior).
- In-field Reconfiguration — Supports background and in-field reprogramming capabilities for design updates while systems remain in operation (TransFR reconfiguration).
- Flexible I/O Standards — Programmable I/O buffers supporting a broad set of interfaces (family-level sysIO support), enabling mixed-voltage system interfacing.
- Power and Low-Power Modes — Operates from 1.71 V to 3.465 V and includes a sleep mode for significant static current reduction (family-level feature).
- Package and Mounting — Surface-mount 256-LFBGA/CSPBGA (supplier device package: 256-CABGA, 14×14 mm) for compact PCB footprint.
- Commercial Temperature Grade — Operating range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Glue Logic and System Control — Replace discrete logic networks and CPLDs with a single-chip solution for power-up sequencing, reset logic and board-level control.
- Bus Bridging and Interface Conversion — Implement protocol adaptation and bus interfacing where high I/O count and flexible I/O standards are required.
- Peripheral and Sensor Interfacing — Aggregate and format signals from sensors and peripherals, leveraging distributed RAM for small buffering tasks.
- Field Upgradeable Logic — In-field reconfiguration capability lets you update control logic or add features without replacing hardware.
Unique Advantages
- Instant-on non-volatile operation — Eliminates the need for external configuration memory and enables fast system startup.
- High I/O-to-logic ratio — 159 I/Os combined with 640 logic elements supports dense interfacing while keeping the logic fabric compact.
- Field reprogrammability — Background and in-field programming reduce maintenance complexity and allow iterative feature updates.
- Wide supply voltage support — 1.71 V to 3.465 V operation allows use in systems with multiple core and I/O voltage domains.
- Compact BGA packaging — 256-ball LFBGA/CSPBGA (14×14 mm) minimizes PCB area while providing abundant I/O.
- Commercial-grade reliability — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
Why Choose LCMXO640C-4BN256C?
The LCMXO640C-4BN256C delivers a balanced combination of instant-on non-volatile configuration, mid-range logic capacity (640 logic elements) and high I/O density (159 pins) in a compact 256-ball BGA package. It is well suited to designers seeking a single-chip replacement for discrete glue logic, interface bridging and control functions while retaining the ability to update logic in the field.
Engineers and procurement teams will find this device attractive for cost- and space-sensitive commercial designs that need reliable startup behavior, flexible I/O handling and a straightforward upgrade path through reconfiguration.
If you would like pricing, availability or to request a quote for the LCMXO640C-4BN256C, submit a product inquiry or request a quote through your preferred procurement channel.

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