LCMXO640C-4B256I

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 709 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-4B256I – MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

The LCMXO640C-4B256I is a MachXO family non-volatile FPGA optimized for control, glue-logic and interface tasks. The device combines instant-on, single-chip configurability with a compact 256-ball BGA package and a broad I/O count for flexible board-level integration.

With 640 logic elements and up to 159 I/Os in a 256-ball package, this surface-mount, industrial-grade device supports designs that require fast power-up, reconfigurability in the field, and operation across a wide supply and temperature range.

Key Features

  • Non-volatile, instant-on architecture  Single-chip non-volatile configuration enables power-up in microseconds without external configuration memory.
  • Logic density  640 logic elements provide capacity for glue logic, bus interfacing and control functions.
  • Rich I/O  159 programmable I/Os in a 256-ball package enable high pin-to-pin connectivity for complex board interfaces.
  • Embedded memory  MachXO family architecture provides distributed on-chip RAM (LCMXO640 family level: approximately 6.1 Kbits of distributed RAM).
  • Wide supply range  Operates across a 1.71 V to 3.465 V supply range to support multiple I/O standards and mixed-voltage systems.
  • Industrial temperature range  Rated for operation from −40 °C to 100 °C for robust performance in harsher environments.
  • In-field reconfiguration  TransFR™ Reconfiguration (TFR) and background programming support allow updates to non-volatile logic while the system operates.
  • Low-power modes  Sleep mode capability can reduce static current consumption by up to 100× for power-sensitive applications.
  • Compact package  Available in 256-LFBGA / 256-CABGA (14×14 mm) surface-mount packages for space-constrained designs.
  • Standards and tooling  MachXO family devices support IEEE 1149.1 boundary scan and are supported by the ispLEVER design tools for synthesis, placement and routing.
  • RoHS compliant  Device meets RoHS requirements for environmental compliance.

Typical Applications

  • Glue Logic and Board-Level Control  Implement control-state machines, reset sequencing and handshaking without external configuration components.
  • Bus Bridging and Protocol Translation  Use the device’s I/O density and programmable buffers to implement bus interfacing and signal translation between subsystems.
  • Power-Up and System Sequencing  Instant-on capability and non-volatile configuration simplify power sequencing and system bring-up tasks.
  • Peripheral and Sensor Interfaces  High I/O count supports connecting multiple sensors, displays and peripherals in embedded control applications.

Unique Advantages

  • Instant, single-chip configuration: Eliminates external configuration memory and delivers microsecond-level power-up for faster system readiness.
  • Field reprogrammability: TransFR™ reconfiguration and background programming let you update logic in deployed systems without full shutdown.
  • Versatile I/O and voltage support: Wide supply range and 159 I/Os enable mixed-voltage interfacing and flexible board-level integration.
  • Industrial robustness: Rated −40 °C to 100 °C for reliable operation in demanding environments.
  • Compact footprint with high pin count: 256-ball BGA packages provide a balance of I/O density and PCB area efficiency.
  • Toolchain support: Supported by ispLEVER design tools for synthesis, placement and timing-aware routing to speed development.

Why Choose LCMXO640C-4B256I?

The LCMXO640C-4B256I is positioned for designers who need a compact, non-volatile FPGA that brings CPLD-like instant-on behavior together with FPGA-style flexibility. With 640 logic elements, 159 I/Os, in-field reconfiguration capability and support for a wide supply and temperature range, it is well suited for control, interfacing and sequencing roles in industrial and embedded applications.

Its single-chip configuration model reduces BOM complexity and design risk, while the MachXO family toolchain and architecture make it straightforward to migrate and scale designs within the same device family.

Request a quote or submit an inquiry to receive pricing and availability for the LCMXO640C-4B256I.

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