LCMXO640C-4BN256I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 512 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 159 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80 | Number of Logic Elements/Cells | 640 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO640C-4BN256I – MachXO Field Programmable Gate Array (FPGA)
The LCMXO640C-4BN256I is a MachXO family FPGA offering a non-volatile, instantly configurable single-chip solution for control and glue-logic applications. Built around a 2D array of logic, the device provides 640 logic elements and 80 logic blocks with up to 159 user I/Os in a 256-ball LFBGA (caBGA) package.
Targeted at industrial designs, the device supports wide operating conditions and flexible I/O and configuration options to address bus interfacing, power-up sequencing, control logic and field-update scenarios while eliminating the need for external configuration memory.
Key Features
- Core Logic — 640 logic elements organized across 80 logic blocks for implementing glue logic, state machines and control functions.
- Memory — Distributed RAM support (family details indicate distributed RAM capacity for this device class) and no external configuration memory required thanks to non-volatile architecture.
- I/O — Up to 159 user I/Os in the 256-LFBGA (CSPBGA/caBGA) package, enabling high pin-to-pin connectivity for bus interfacing and peripheral control.
- Power and I/O Voltage — Operates across a wide supply range of 1.71 V to 3.465 V, supporting multiple logic levels used in mixed-voltage systems.
- Packaging & Mounting — Surface-mount 256-CABGA (14×14 mm) package (256-LFBGA, CSPBGA) for compact, high-density board designs.
- Temperature Range & Grade — Industrial-grade device specified for operation from −40 °C to 100 °C.
- Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration with instant-on behavior; no external configuration memory required.
- In-field Reconfiguration & Power Management — Device family supports in-field logic updates and sleep modes offering significant static current reduction.
Typical Applications
- Glue Logic and System Control — Implement address decoding, reset sequencing and peripheral control with dedicated logic resources and fast start-up.
- Bus Bridging and Interface Conversion — Use the device’s high I/O count to bridge buses and perform protocol adaptation at board level.
- Power-Up and Sequencing Control — Implement deterministic power-up control and sequencing without external configuration memory.
- Field-Upgradeable Control Logic — Support in-field updates and background programming for maintenance and feature enhancements without full system downtime.
Unique Advantages
- Single-Chip, Non-Volatile Configuration — Eliminates the need for external configuration memory, simplifying BOM and improving system security.
- Instant-On Capability — Powers up and configures quickly for fast system initialization.
- High I/O-to-Logic Density — 159 I/Os paired with 640 logic elements enable dense interfacing with peripherals and buses.
- Industrial Temperature Range — Rated for −40 °C to 100 °C to meet demanding environmental conditions.
- Flexible Voltage Support — Operates across 1.71 V to 3.465 V supplies to accommodate multiple I/O standards and mixed-voltage boards.
- In-field Reconfiguration and Low-Power Modes — Supports background programming and sleep mode for reduced static current and in-system updates.
Why Choose LCMXO640C-4BN256I?
The LCMXO640C-4BN256I positions itself as a compact, industrial-grade, non-volatile FPGA suited for control, interfacing and system-management roles where instant-on behavior and high I/O density matter. With 640 logic elements, 159 I/Os and a 256-ball caBGA footprint, it simplifies board-level integration while providing the reconfigurability and security advantages of on-chip non-volatile configuration.
Designers seeking a reliable, upgradeable single-chip solution for glue logic, bus bridging, power sequencing and in-field updates will find the MachXO architecture and industrial operating range a practical fit. The device’s flexible supply range and programmable I/O capabilities support a variety of mixed-voltage interfaces, aiding scalability and long-term maintenance.
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