LCMXO640C-4BN256I

IC FPGA 159 I/O 256CABGA
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 159 640 256-LFBGA, CSPBGA

Quantity 512 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGA, CSPBGANumber of I/O159Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80Number of Logic Elements/Cells640
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO640C-4BN256I – MachXO Field Programmable Gate Array (FPGA)

The LCMXO640C-4BN256I is a MachXO family FPGA offering a non-volatile, instantly configurable single-chip solution for control and glue-logic applications. Built around a 2D array of logic, the device provides 640 logic elements and 80 logic blocks with up to 159 user I/Os in a 256-ball LFBGA (caBGA) package.

Targeted at industrial designs, the device supports wide operating conditions and flexible I/O and configuration options to address bus interfacing, power-up sequencing, control logic and field-update scenarios while eliminating the need for external configuration memory.

Key Features

  • Core Logic — 640 logic elements organized across 80 logic blocks for implementing glue logic, state machines and control functions.
  • Memory — Distributed RAM support (family details indicate distributed RAM capacity for this device class) and no external configuration memory required thanks to non-volatile architecture.
  • I/O — Up to 159 user I/Os in the 256-LFBGA (CSPBGA/caBGA) package, enabling high pin-to-pin connectivity for bus interfacing and peripheral control.
  • Power and I/O Voltage — Operates across a wide supply range of 1.71 V to 3.465 V, supporting multiple logic levels used in mixed-voltage systems.
  • Packaging & Mounting — Surface-mount 256-CABGA (14×14 mm) package (256-LFBGA, CSPBGA) for compact, high-density board designs.
  • Temperature Range & Grade — Industrial-grade device specified for operation from −40 °C to 100 °C.
  • Non-volatile, Instant-on Architecture — Single-chip non-volatile configuration with instant-on behavior; no external configuration memory required.
  • In-field Reconfiguration & Power Management — Device family supports in-field logic updates and sleep modes offering significant static current reduction.

Typical Applications

  • Glue Logic and System Control — Implement address decoding, reset sequencing and peripheral control with dedicated logic resources and fast start-up.
  • Bus Bridging and Interface Conversion — Use the device’s high I/O count to bridge buses and perform protocol adaptation at board level.
  • Power-Up and Sequencing Control — Implement deterministic power-up control and sequencing without external configuration memory.
  • Field-Upgradeable Control Logic — Support in-field updates and background programming for maintenance and feature enhancements without full system downtime.

Unique Advantages

  • Single-Chip, Non-Volatile Configuration — Eliminates the need for external configuration memory, simplifying BOM and improving system security.
  • Instant-On Capability — Powers up and configures quickly for fast system initialization.
  • High I/O-to-Logic Density — 159 I/Os paired with 640 logic elements enable dense interfacing with peripherals and buses.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C to meet demanding environmental conditions.
  • Flexible Voltage Support — Operates across 1.71 V to 3.465 V supplies to accommodate multiple I/O standards and mixed-voltage boards.
  • In-field Reconfiguration and Low-Power Modes — Supports background programming and sleep mode for reduced static current and in-system updates.

Why Choose LCMXO640C-4BN256I?

The LCMXO640C-4BN256I positions itself as a compact, industrial-grade, non-volatile FPGA suited for control, interfacing and system-management roles where instant-on behavior and high I/O density matter. With 640 logic elements, 159 I/Os and a 256-ball caBGA footprint, it simplifies board-level integration while providing the reconfigurability and security advantages of on-chip non-volatile configuration.

Designers seeking a reliable, upgradeable single-chip solution for glue logic, bus bridging, power sequencing and in-field updates will find the MachXO architecture and industrial operating range a practical fit. The device’s flexible supply range and programmable I/O capabilities support a variety of mixed-voltage interfaces, aiding scalability and long-term maintenance.

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