LCMXO640C-4FN256I

The LCMXO640C-4FN256I is a MachXO series Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation, offered in a 256-ball BGA (256-FPBGA, 17×17) surface-mount package. It provides 640 logic elements and up to 159 I/O pins, making it suitable for compact, I/O‑rich embedded applications.

Designed for industrial environments, the device supports a wide supply range of 1.71 V to 3.465 V and an operating temperature range of -40°C to 100°C, providing flexibility for a range of industrial designs that require reliable logic integration and configurable I/O.

Key Features

• Core Logic — 640 logic elements for implementing glue logic, finite-state machines, and small-scale custom logic functions.
• I/O Capacity — Up to 159 I/O pins to handle multiple interfaces, signal routing and board-level integration without additional components.
• Package — 256-BGA (supplier package: 256-FPBGA, 17×17) surface-mount package for compact board footprint and high pin density.
• Power Supply Range — Operates from 1.71 V to 3.465 V, enabling compatibility with a variety of system voltage domains.
• Operating Temperature — Industrial-grade operation from -40°C to 100°C for deployment in temperature-challenging environments.
• Embedded Memory — Total on-chip RAM: 0 bits.
• Compliance — RoHS compliant, supporting environmental and manufacturability requirements.
• Mounting — Surface mount device suitable for standard PCB assembly processes.

Typical Applications

• Industrial Control — Use the 640 logic elements and 159 I/O pins to implement control logic, signal conditioning, and interface glue in industrial automation equipment within the specified -40°C to 100°C range.
• Interface Bridging — Implement protocol translation, bus bridging, and I/O adaptation where multiple signals and configurable logic are required on a compact BGA footprint.
• Human‑Machine Interfaces (HMI) — Manage button matrices, LED drivers, and peripheral interfaces using available I/O and logic resources in space-constrained control panels.

Unique Advantages

• Right‑sized Logic Density: 640 logic elements provide enough programmable resources for glue logic and small custom functions without over-provisioning.
• High I/O Count in a Compact Package: 159 I/O in a 256-BGA (17×17) package enables dense connectivity while conserving board area.
• Wide Supply Flexibility: Support for 1.71 V to 3.465 V allows integration into mixed-voltage systems and simplifies power-rail planning.
• Industrial Temperature Support: -40°C to 100°C operation aligns the device with industrial deployment requirements for increased environmental robustness.
• RoHS Compliant: Environmentally compliant construction aids manufacturability and regulatory alignment.
• Surface-Mount Compatibility: 256-FPBGA package supports standard SMT assembly for reliable, repeatable production.

Why Choose LCMXO640C-4FN256I?

The LCMXO640C-4FN256I positions itself as a compact, industrial-grade MachXO FPGA option for designers who need a balance of logic capacity and high I/O density in a small BGA package. With 640 logic elements and up to 159 I/O pins, it addresses board-level glue logic, interface consolidation, and control functions while supporting a broad supply voltage and industrial temperature range.

This part is well suited to teams building space-conscious industrial or embedded systems that require configurable logic, robust operating temperatures, and RoHS-compliant sourcing. Its combination of package density, I/O count, and supply flexibility supports scalable designs and straightforward integration into existing production processes.

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