LFE2-12SE-6F256C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 193 226304 12000 256-BGA |
|---|---|
| Quantity | 1,993 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 193 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-6F256C – ECP2 Field Programmable Gate Array (FPGA), 12,000 logic elements, 256‑BGA
The LFE2-12SE-6F256C is a Lattice ECP2 family FPGA offering 12,000 logic elements in a 256‑ball fpBGA (17 × 17 mm) package. Designed for commercial-grade embedded systems, this device combines on‑chip memory, DSP resources and flexible I/O to support mid-range logic integration and system control functions.
With 193 available I/Os, approximately 0.226 Mbits of embedded RAM, and a low-voltage core supply range, the device targets applications that require compact, surface‑mount FPGA integration with moderate logic and memory requirements.
Key Features
- Logic Capacity Approximately 12,000 logic elements and 1,500 logic blocks provide a balanced fabric for mid‑density designs.
- Embedded Memory Total on‑chip RAM of 226,304 bits (approximately 0.226 Mbits) suitable for control buffers, state machines and small data storage.
- sysDSP Resources Includes 6 sysDSP blocks and 24 18×18 multipliers for dedicated multiply–accumulate and signal processing tasks.
- I/O 193 user I/Os available in the 256‑ball fpBGA package to support parallel interfaces and mixed‑signal front ends.
- Clocking Device configuration supports 2 general‑purpose PLLs and 2 DLLs for flexible clock management and phase adjustment.
- Power Core voltage supply range from 1.14 V to 1.26 V to match low‑voltage system rails.
- Package & Mounting 256‑FPBGA (17 × 17 mm) package, surface mount mounting type for compact board designs.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Standards & Tools Designed for use with Lattice design tools and supports features such as SPI boot flash interface, dual boot images and boundary scan compliance as described in the ECP2 family data.
- Environmental RoHS compliant.
Typical Applications
- Network and Interface Bridging Use the device’s I/O density and clocking resources for protocol bridging, packet pre‑processing and peripheral aggregation in communication equipment.
- Embedded Control Suitable for control logic, state machines and sequencing in instrumentation and consumer electronics where mid‑range logic and on‑chip RAM are required.
- Signal Processing Leverage sysDSP blocks and 18×18 multipliers for fixed‑point filtering, decimation/interpolation and basic DSP pipelines.
- Memory Interface Support Use dedicated DDR/DDR2 support and DDR registers in I/O cells (as provided by the ECP2 family) for external memory buffering and high‑speed data capture.
Unique Advantages
- Balanced Mid‑Density Fabric: 12,000 logic elements and 1,500 logic blocks offer a compromise between small devices and larger FPGAs for cost‑sensitive designs.
- Integrated DSP and RAM: On‑chip sysDSP blocks together with approximately 0.226 Mbits of embedded RAM reduce external component needs for common signal processing tasks.
- Flexible I/O Count: 193 I/Os in a compact 256‑ball fpBGA enable multiple parallel interfaces while maintaining a small PCB footprint.
- Compact Surface‑Mount Package: 256‑FPBGA (17 × 17 mm) simplifies board layout for space‑constrained applications without sacrificing I/O availability.
- Low‑Voltage Core: 1.14 V to 1.26 V core supply range aligns with modern low‑voltage system rails for efficient power design.
- Commercial‑Grade Availability: Designed for commercial applications with RoHS compliance and standard operating temperature coverage (0 °C to 85 °C).
Why Choose LFE2-12SE-6F256C?
The LFE2-12SE-6F256C positions itself as a practical, mid‑density FPGA choice for embedded designers who need a mix of logic, on‑chip memory and DSP capability in a compact surface‑mount package. Its 12,000 logic elements, sysDSP resources and nearly 0.226 Mbits of embedded RAM provide the building blocks for control, signal processing and interface tasks without excessive board area or BOM complexity.
Ideal for teams implementing communication interfaces, mixed‑signal front ends or control systems, this commercial‑grade ECP2 device offers predictable operating conditions, a defined I/O count and toolchain support from the ECP2 family documentation for scalable design development.
Request a quote or submit a quote request to get pricing and availability for the LFE2-12SE-6F256C.

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