LFE2-12SE-6FN256C

The LFE2-12SE-6FN256C is a commercial-grade FPGA from Lattice Semiconductor Corporation in the ECP2 family, offering programmable logic resources and on-chip memory in a compact BGA package. It combines approximately 12,000 logic elements, roughly 0.226 Mbits of embedded RAM, and 193 I/O pins to support mid-range custom logic integration.

Designed for surface-mount assembly, the device operates from a core voltage range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. RoHS compliance ensures alignment with common environmental requirements.

Key Features

• Core Logic Approximately 12,000 logic elements for implementing custom digital functions and glue logic.
• Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM to support buffering, state storage, and small data structures.
• I/O Resources 193 available I/O pins to accommodate multiple peripheral interfaces and board-level signals.
• Power Core supply voltage range of 1.14 V to 1.26 V for predictable power budgeting and design.
• Package & Mounting 256-ball BGA (256-FPBGA, 17 × 17) in a surface-mount form factor for compact, high-density PCB layouts.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C suitable for typical commercial electronics deployments.
• Environmental Compliance RoHS compliant to meet common environmental regulations.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and protocol handling where moderate logic density and on-chip RAM are required.
• Prototyping and Production Designs — Use the programmable fabric to develop and deploy mid-range logic functions without custom ASIC development.
• I/O-Intensive Interfaces — Take advantage of the 193 I/O pins to connect multiple peripherals, sensors, and external devices.
• Compact PCB Designs — The 256-BGA package enables high-density board layouts while delivering substantial logic capacity.

Unique Advantages

• Mid-Range Logic Capacity: Approximately 12,000 logic elements provide a balance between capability and cost for many commercial designs.
• Integrated On-Chip Memory: Around 0.226 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• High I/O Count: 193 I/Os simplify system integration by supporting multiple signals and interfaces directly from the FPGA.
• Compact, Surface-Mount BGA Package: The 256-FPBGA (17 × 17) footprint supports dense PCB layouts and modern assembly processes.
• Low-Voltage Core Operation: A narrow core voltage range (1.14–1.26 V) helps with consistent power design and supply selection.
• Commercial Suitability and Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product requirements.

Why Choose LFE2-12SE-6FN256C?

The LFE2-12SE-6FN256C delivers a practical combination of logic capacity, embedded memory, and I/O resources in a compact 256-BGA package from Lattice Semiconductor Corporation. Its specifications make it well suited for commercial designs that need mid-range programmable logic, moderate on-chip RAM, and extensive interfacing without moving to larger devices.

For engineering teams and procurement focused on footprint-conscious, surface-mount solutions, this FPGA offers a balanced option for production or advanced prototypes where RoHS compliance and commercial temperature operation are required.

Request a quote or submit a pricing inquiry to check availability and lead times for the LFE2-12SE-6FN256C.