LFE2-12SE-6FN484I

IC FPGA 297 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA

Quantity 599 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O297Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1500Number of Logic Elements/Cells12000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits226304

Overview of LFE2-12SE-6FN484I – ECP2 Field Programmable Gate Array (FPGA), 12,000 Logic Elements, 484-BBGA

The LFE2-12SE-6FN484I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a programmable logic fabric with 12,000 logic elements and 1,500 LABs to support mid-density programmable designs.

This device integrates on-chip RAM, a broad I/O count and an industrial operating range, making it suitable for designs that require substantial I/O connectivity and reliable operation across −40°C to 100°C. It is supplied in a 484-BBGA package intended for surface-mount assembly and is RoHS compliant.

Key Features

  • Core / Logic 12,000 logic elements and 1,500 LABs provide the programmable fabric for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 0.226 Mbits (226,304 bits) of on-chip RAM for buffering, state storage, and small LUT-based memory structures.
  • I/O Capacity Up to 297 I/O pins to support extensive peripheral interfacing and parallel signal connectivity.
  • Power Core supply range of 1.14 V to 1.26 V to match low-voltage system domains and core power rails.
  • Package & Mounting 484-BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
  • Industrial Temperature Range Rated for operation from −40°C to 100°C for use in thermally demanding environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • Substantial Logic Capacity: 12,000 logic elements enable implementation of medium-complexity digital systems without external programmable logic.
  • High I/O Count: 297 I/O pins accommodate multiple parallel interfaces, sensor arrays, and board-level connectivity requirements.
  • On-Chip RAM for Local Storage: Approximately 0.226 Mbits of embedded memory supports buffering and small data structures close to logic.
  • Industrial Temperature Rating: −40°C to 100°C operation supports deployment in temperature-critical applications.
  • Compact BGA Footprint: 484-BBGA (484-FPBGA, 23×23) balances pin density and board space for compact designs.
  • Low-Voltage Core Compatibility: Operation from 1.14 V to 1.26 V aligns with modern low-voltage power domains.

Why Choose LFE2-12SE-6FN484I?

The LFE2-12SE-6FN484I positions itself as a mid-density FPGA solution combining 12,000 logic elements, substantial I/O capacity and embedded RAM within a compact 484-BBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for designs that require reliable operation across a wide thermal range while maintaining a dense I/O complement.

This device is suited to engineers and procurement teams seeking a Lattice Semiconductor FPGA offering predictable logic density, on-chip memory and high I/O count in a surface-mount BGA package. Its specifications support scalable integration into a variety of programmable logic designs where these specific electrical, thermal and package attributes are required.

Request a quote or submit an inquiry to receive pricing and availability for the LFE2-12SE-6FN484I. Our team can assist with lead times and volume options to support your design and sourcing needs.

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