LFE2-12SE-6FN256I

The LFE2-12SE-6FN256I is an ECP2-series field programmable gate array from Lattice Semiconductor Corporation. It integrates 12,000 logic elements and 1,500 configurable logic blocks (CLBs) in a 256-ball BGA package aimed at embedded and industrial applications.

With 193 I/O pins, approximately 0.226 Mbits of embedded RAM, and a 1.14–1.26 V core supply range, this surface-mount FPGA is specified for operation from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic 12,000 logic elements and 1,500 CLBs provide flexible programmable logic capacity for mid-range designs.
• Embedded Memory Approximately 0.226 Mbits of on-chip RAM to support buffering, packet queues, and small data storage needs.
• I/O Density 193 general-purpose I/O pins allow for substantial peripheral and interface connectivity in compact designs.
• Power Core supply range of 1.14 V to 1.26 V to match system power architectures and deliver predictable power requirements.
• Package and Mounting 256-ball FPBGA (17×17) package in a surface-mount form factor for high-density board layouts.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Regulatory RoHS compliant for environmental and manufacturing compliance needs.

Typical Applications

• Industrial Control Use as a programmable logic element for control, sequencing, and I/O consolidation in industrial automation systems.
• Embedded Systems Implements custom logic, glue functions, and peripheral interfaces in compact embedded devices.
• Communications and Networking Enables protocol bridging, packet buffering, and interface adaptation with its mix of logic and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory Combines 12,000 logic elements with on-chip RAM to handle both control logic and moderate buffering without external memory.
• High I/O Count 193 I/O pins simplify system-level integration by reducing the need for additional interface components.
• Industrial-Grade Operation Specified for −40 °C to 100 °C, suitable for a wide range of industrial operating conditions.
• Compact, Surface-Mount Package 256-FPBGA (17×17) offers a high-density footprint for space-constrained PCB designs.
• Compliance-Ready RoHS compliance supports regulatory and manufacturing requirements for modern electronics production.

Why Choose LFE2-12SE-6FN256I?

The LFE2-12SE-6FN256I provides a pragmatic mix of programmable logic, I/O capacity, and embedded memory in a compact 256-BGA package, making it well suited for industrial and embedded designs that require reliable, field-programmable logic. Its industrial temperature rating and RoHS compliance support deployment in demanding production environments.

Designed by Lattice Semiconductor Corporation, this FPGA is appropriate for engineers and procurement teams seeking a mid-range programmable device with clear, verifiable specifications for logic capacity, I/O, power, and thermal operation.

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