LFE2-12SE-6F256I

The LFE2-12SE-6F256I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor's ECP2 family. It provides a mid-range fabric with 12,000 logic elements and abundant I/O suitable for embedded and industrial applications.

With support for industrial operating temperatures, a compact 256-ball BGA package, and a low-voltage core supply range, this device targets designs that require configurable logic, significant I/O count, and reliable operation across wide temperature ranges.

Key Features

• Core Logic  12,000 logic elements and 1,500 configurable logic blocks (CLBs) provide programmable resources for custom logic, control functions, and glue-logic integration.
• Embedded Memory  Approximately 0.226 Mbits of on-chip RAM (226,304 total RAM bits) for buffers, FIFOs, and small data stores without external memory.
• I/O Capacity  193 general-purpose I/O pins to support multiple parallel interfaces, sensor arrays, and peripheral connectivity on a single device.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V to support low-voltage system designs and standard FPGA power architectures.
• Package and Mounting  256-ball BGA in a 256-FPBGA (17×17) supplier package; surface-mount mounting for compact PCB implementations.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments and equipment.
• Environmental Compliance  RoHS compliant to meet current material-restriction requirements.

Typical Applications

• Industrial Control  Implement custom control logic, protocol bridging, and I/O aggregation in factory automation and process control systems, leveraging the industrial temperature rating and broad I/O count.
• Embedded Systems  Integrate application-specific logic, peripheral interfaces, and hardware acceleration in embedded devices using the device’s 12,000 logic elements and on-chip RAM.
• Communications and Protocol Conversion  Use the 193 I/O pins to route multiple serial and parallel interfaces for gateway, bridge, and protocol conversion tasks.
• OEM and Instrumentation  Deploy reliable configurable logic in instrumentation, test equipment, and custom OEM designs where industrial temperature range and compact packaging matter.

Unique Advantages

• Balanced Logic and Memory  The combination of 12,000 logic elements and approximately 0.226 Mbits of embedded RAM enables both control-heavy and data-buffering functions on-chip.
• High I/O Density  193 I/O pins reduce the need for intermediate multiplexers or external interface chips, simplifying board-level design.
• Industrial Reliability  Rated from −40 °C to 100 °C for operation in demanding environments where extended temperature capability is required.
• Compact, Manufacturable Package  256-ball FPBGA (17×17) package in a surface-mount form factor supports dense PCB layouts and automated assembly.
• Low-Voltage Core  Core supply range of 1.14 V to 1.26 V supports modern low-voltage system architectures and power sequencing strategies.
• RoHS Compliant  Meets material compliance expectations for global manufacturing and distribution.

Why Choose LFE2-12SE-6F256I?

The LFE2-12SE-6F256I positions itself as a versatile, industrial-grade FPGA option for designs that need a balance of programmable logic, on-chip memory, and substantial I/O in a compact package. Its combination of 12,000 logic elements, 193 I/Os, and operation from −40 °C to 100 °C make it well suited for embedded and industrial applications where configurability and reliable operation matter.

For engineers and procurement teams seeking a scalable, field-programmable solution with a compact 256‑BGA footprint and RoHS compliance, this device offers a clear mix of integration and environmental robustness to support long-term product deployments.

Request a quote today to check pricing and availability for the LFE2-12SE-6F256I and to discuss quantities and lead times with our team.