LFE2-12SE-6F484I

The LFE2-12SE-6F484I is an ECP2 Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for industrial applications. It combines 12,000 logic elements with on-chip memory and a high I/O count to support dense, configurable logic implementations.

With a 484‑ball BGA package, surface-mount mounting, a low operating voltage range of 1.14–1.26 V and an extended temperature rating from −40 °C to 100 °C, this device is suited to designs that require compact integration, high I/O connectivity and industrial temperature tolerance.

Key Features

• Core / Logic: 12,000 logic elements for implementing custom digital logic and signal processing functions.
• Embedded Memory: Approximately 0.23 Mbits of on-chip RAM (226,304 total RAM bits) to support buffering, state storage and local data processing.
• I/O Density: 297 device I/O pins to connect multiple peripherals, buses and external interfaces directly to the FPGA fabric.
• Power: Low-voltage operation with a supply range of 1.14 V to 1.26 V for core power planning and efficient system design.
• Package & Mounting: 484‑BBGA package (supplier device package: 484‑FPBGA, 23×23) in a surface‑mount form factor for space‑constrained PCBs.
• Temperature Range: Industrial operating range from −40 °C to 100 °C to meet harsher environment requirements.
• Environmental Compliance: RoHS compliant to support regulated manufacturing processes.

Typical Applications

• Industrial Control Systems: Use the device’s industrial temperature rating and logic capacity for control and automation tasks in factory and process environments.
• High‑Density I/O Aggregation: Leverage 297 I/O pins to consolidate multiple sensor, actuator or peripheral interfaces on a single programmable device.
• Custom Logic and Glue Logic: Implement protocol bridging, timing control and custom data paths using the available logic elements and embedded RAM.

Unique Advantages

• High Logic Capacity: 12,000 logic elements provide substantial programmable resources for complex designs without external ASICs.
• Significant On‑Chip Memory: Approximately 0.23 Mbits of embedded RAM reduces dependence on external memory for many buffering and control tasks.
• Extensive I/O: 297 I/Os simplify board-level routing and reduce the need for additional interface components.
• Industry‑Grade Thermal Range: Rated from −40 °C to 100 °C to support deployment in challenging environmental conditions.
• Compact BGA Packaging: 484‑BBGA (23×23) package delivers a compact, high‑pin‑count solution for dense PCB designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose LFE2-12SE-6F484I?

The LFE2-12SE-6F484I delivers a balanced combination of logic density, on‑chip memory and high I/O count in a compact BGA package with industrial temperature capability. It is positioned for designs that require reliable programmable logic in environments that demand extended temperature performance and a low-voltage core.

This FPGA is suitable for engineers and procurement teams seeking a configurable, industrial-grade device from Lattice Semiconductor that reduces system complexity by consolidating logic, memory and connectivity into a single package while meeting environmental compliance requirements.

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