LFE2-12SE-6FN484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 297 226304 12000 484-BBGA |
|---|---|
| Quantity | 727 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 297 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1500 | Number of Logic Elements/Cells | 12000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 226304 |
Overview of LFE2-12SE-6FN484C – ECP2 Field Programmable Gate Array, 12,000 logic elements, 484-BBGA
The LFE2-12SE-6FN484C is an ECP2 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a mid-range programmable fabric with 12,000 logic elements and a high I/O count, packaged in a compact 484-ball BGA for surface-mount applications.
This device is suited for commercial embedded designs that require substantial I/O, on-chip memory for data buffering, and low-voltage core operation. Its combination of logic density, embedded RAM, and a dense BGA footprint enables integration of control, interface, and processing functions on a single device.
Key Features
- Logic Capacity — 12,000 logic elements provide the programmable resources needed for mid-density digital designs and custom logic implementations.
- Embedded Memory — Approximately 0.226 Mbits (226,304 bits) of on-chip RAM supports buffering, FIFOs, and small data structures without external memory.
- I/O Density — 297 available I/O pins enable complex interfacing, parallel buses, and multiple serial/parallel peripherals in a single FPGA.
- Power — Core voltage supply range of 1.14 V to 1.26 V to match modern low-voltage system rails.
- Package and Mounting — 484-FPBGA (23×23) / 484-BBGA package in a surface-mount form factor for space-constrained PCBs.
- Operating Range — Commercial temperature range of 0 °C to 85 °C for standard embedded and consumer applications.
- Compliance — RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- Interface Bridging and Protocol Conversion — Use the high I/O count and programmable logic to implement parallel-to-serial bridges, protocol adaptation, and multi-bus interfacing.
- Embedded Control and Signal Processing — Implement custom control logic, state machines, and moderate-throughput signal processing using available logic elements and on-chip RAM.
- Communications and Networking Modules — Leverage the I/O density and embedded memory for packet buffering, framing, and peripheral conditioning in communications equipment.
Unique Advantages
- High Logic Density — 12,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity.
- Significant On-chip Memory — Approximately 0.226 Mbits of embedded RAM supports local buffering and reduces dependence on external memory components.
- Extensive I/O — 297 I/O pins give flexibility to connect numerous peripherals and interfaces directly to the FPGA fabric.
- Compact, Surface-Mount BGA — The 484-ball FPBGA (23×23) footprint helps minimize PCB area while providing a high pin count for dense designs.
- Low-Voltage Core Compatibility — 1.14–1.26 V supply range accommodates modern low-voltage system architectures.
- RoHS Compliance — Meets common environmental and manufacturing standards for lead-free production.
Why Choose LFE2-12SE-6FN484C?
The LFE2-12SE-6FN484C positions itself as a practical mid-range FPGA for commercial embedded systems that need a balance of logic capacity, on-chip memory, and high I/O in a compact BGA package. Its specification set is aligned to designs that consolidate interface logic, buffering, and control functions onto a single programmable device.
Engineers and designers seeking a commercially graded FPGA with defined operating temperature and low-voltage core support will find this part appropriate for space-constrained boards that require substantial I/O and embedded memory. Documentation and family datasheet support are available from the manufacturer to assist integration and development.
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