LFE2-20SE-6F672C

The LFE2-20SE-6F672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor's ECP2 family. It delivers a balance of gate density, on-chip memory and I/O capacity in a compact ball-grid array package for commercial-grade designs.

With 21,000 logic elements, 402 I/O pins and approximately 0.28 Mbits of embedded RAM, this surface-mount FPGA is intended for applications that require moderate logic complexity, significant I/O connectivity and low-voltage core operation (1.14 V to 1.26 V).

Key Features

• Core Logic 21,000 logic elements provide the programmable fabric to implement custom logic, state machines and glue-logic functions.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for buffering, FIFOs and small lookup tables.
• I/O Capacity 402 user I/O pins support high pin-count interfaces and multiple parallel connections.
• Power Core supply range of 1.14 V to 1.26 V to match low-voltage system requirements.
• Package & Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27×27) designed for surface-mount assembly in space-constrained board layouts.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation for use in standard commercial environments.

Typical Applications

• Protocol Conversion & Interface Bridging Use the device's 402 I/O and programmable logic to implement parallel-to-serial bridges, level translation control and custom protocol adapters.
• Embedded Control & Glue Logic Implement control state machines, timing logic and peripheral management leveraging 21,000 logic elements and on-chip RAM for local buffering.
• Communication Endpoints Deploy in systems requiring sizable I/O counts and moderate logic density for endpoint processing and I/O aggregation.

Unique Advantages

• High I/O Count: 402 I/Os allow direct interfacing to many peripherals and bus structures, reducing external interface components.
• Balanced Logic Density: 21,000 logic elements provide room for complex control and data-path implementations without overspecifying device size.
• On-chip Memory: Approximately 0.28 Mbits of embedded RAM enables local data buffering and small LUT-based storage without external memory.
• Compact BGA Package: 672-BBGA (27×27) offers a compact footprint for high-density PCB designs while maintaining large I/O availability.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with mainstream electronic product requirements.
• Low-voltage Core Compatibility: 1.14–1.26 V supply range supports integration into low-voltage power domains.

Why Choose LFE2-20SE-6F672C?

The LFE2-20SE-6F672C positions itself as a versatile mid-density FPGA for designers who need substantial I/O, moderate programmable logic and on-chip memory in a compact surface-mount BGA package. Its commercial temperature rating and defined supply range make it suitable for mainstream embedded and connectivity applications.

As part of the Lattice Semiconductor ECP2 family, this device is aimed at teams looking to implement custom interfacing, control logic and protocol handling with a predictable feature set and package option. The combination of 21,000 logic elements, 402 I/Os and approximately 0.28 Mbits of RAM delivers practical integration benefits for BOM reduction and simplified PCB routing.

Request a quote or submit an inquiry to receive pricing and availability for LFE2-20SE-6F672C and to discuss how this FPGA can fit your next design.