LFE2-20SE-6FN256C

The LFE2-20SE-6FN256C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation in the ECP2 family. It provides a balance of on-chip logic, embedded memory, and a high I/O count in a compact 256-ball BGA package for commercial-grade electronic designs.

With 21,000 logic elements, approximately 0.28 Mbits of embedded memory and 193 general-purpose I/Os, this device suits designs that require significant logic integration and dense I/O in a surface-mount BGA footprint.

Key Features

• Logic Capacity  21,000 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 0.28 Mbits (282,624 bits) of on-chip RAM for data buffering, small FIFOs or lookup tables.
• I/O Density  193 I/O pins to support wide parallel interfaces, multiple peripherals, or high pin-count bridging roles.
• Package and Mounting  256-ball BGA (supplier device package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB integration.
• Power Supply  Operates from 1.14 V to 1.26 V, matching low-voltage supply domains common in modern systems.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard commercial-environment deployments.
• Environmental Compliance  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Embedded Logic Integration  Implement custom control logic, glue logic, or protocol bridging where substantial on-chip logic and I/O are required.
• I/O Expansion and Interface Bridging  Use the device to aggregate or translate many peripheral signals thanks to its 193 I/Os and compact BGA package.
• Memory Buffering  Employ the on-chip RAM for buffering, small FIFO implementations, or temporary data storage in data-path designs.
• Commercial Electronics  Target commercial-grade equipment and consumer systems that operate within the specified 0 °C to 85 °C range.

Unique Advantages

• Substantial Logic Density: 21,000 logic elements enable complex logic functions and moderate-scale digital systems without external CPLDs or additional FPGAs.
• Generous I/O Count: 193 I/Os reduce the need for external multiplexers or I/O expanders in high-pin-count designs.
• Compact, Manufacturable Package: The 256-FPBGA (17×17 mm) BGA provides a small board footprint while supporting surface-mount assembly processes.
• On-Board RAM: Approximately 0.28 Mbits of embedded memory supports buffering and small data-store requirements without external SRAM.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant to align with standard commercial manufacturing and regulatory needs.
• Low-Voltage Supply: Operation between 1.14 V and 1.26 V fits modern low-voltage system domains and power-rail architectures.

Why Choose LFE2-20SE-6FN256C?

The LFE2-20SE-6FN256C provides a balanced combination of logic capacity, embedded memory, and a high I/O count in a compact 256-BGA package from Lattice Semiconductor Corporation. Its specifications make it well suited for commercial designs that require moderate logic integration, significant I/O connectivity, and on-chip RAM while fitting within low-voltage supply environments.

Choose this part when your design demands a surface-mount FPGA with around 21,000 logic elements, approximately 0.28 Mbits of embedded memory, and 193 I/Os in a commercial-temperature, RoHS-compliant package.

Request a quote or submit an inquiry for LFE2-20SE-6FN256C to obtain pricing and availability information.