LFE2-20SE-6FN484C

The LFE2-20SE-6FN484C is an ECP2 family field programmable gate array (FPGA) offered in a 484-ball BBGA package for surface-mount applications. It provides a balanced combination of logic capacity, on-chip memory and high I/O density for commercial-grade embedded designs.

With 21,000 logic elements, 331 I/O pins and approximately 0.28 Mbits of embedded RAM, this device is suited for applications that require substantial programmable logic and flexible interfacing in a compact package while operating within a 1.14 V to 1.26 V supply range and 0 °C to 85 °C commercial temperature window.

Key Features

• Core Logic Approximately 21,000 logic elements provide the programmable fabric needed for moderate-complexity control, glue-logic and custom processing functions.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 total RAM bits) for data buffering, FIFOs and small on-chip data structures.
• I/O Density 331 user I/O pins enable wide interfacing options for parallel buses, multiple serial lanes or mixed-signal front ends when combined with external transceivers.
• Power Operates from a specified supply range of 1.14 V to 1.26 V, enabling designs targeting low-voltage core domains.
• Package & Mounting 484-ball BBGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact board integration and dense system layouts.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature range for typical consumer and general-purpose embedded environments.
• RoHS Compliance RoHS-compliant construction supports environmental and regulatory considerations for commercial electronics.

Typical Applications

• Embedded Logic Acceleration Use the programmable fabric and on-chip RAM for offloading control loops, custom processing or real-time data steering in embedded systems.
• Interface Bridging High I/O count supports protocol translation and bus bridging between diverse peripherals and host processors.
• Prototyping & Development Provides a flexible platform for validating custom logic, timing schemes and I/O strategies in proof-of-concept and pre-production boards.
• Consumer Electronics Control Compact BBGA package and moderate logic capacity make it suitable for control and interface functions in consumer and general-purpose products.

Unique Advantages

• Substantial Logic Capacity: Approximately 21,000 logic elements enable implementation of sizeable custom logic without immediate need for larger devices.
• High I/O Count: 331 I/O pins provide flexibility for multi-channel interfaces, parallel peripherals and dense connector requirements.
• On-Chip Memory: Approximately 0.28 Mbits of embedded RAM supports buffering and local data storage to reduce external memory dependence.
• Compact Surface-Mount Package: 484-BBGA (484-FPBGA, 23×23) balances board area efficiency with routing density for space-constrained designs.
• Low-Voltage Operation: 1.14 V to 1.26 V supply range allows integration into modern low-voltage power architectures.
• Commercial-Grade & RoHS-Compliant: Designed for mainstream electronic products with environmental compliance for commercial manufacturing.

Why Choose LFE2-20SE-6FN484C?

The LFE2-20SE-6FN484C delivers a practical mix of programmable logic, embedded memory and high I/O count in a compact 484-ball BBGA package, aimed at commercial embedded designs that require flexibility and integration. Its specified voltage and temperature ranges make it suitable for typical consumer and general-purpose electronics where balanced performance and footprint matter.

Designers seeking a scalable FPGA option with verified on-chip resources and RoHS compliance will find this device appropriate for prototyping, interface consolidation and deployment in volume programs where commercial-grade operation is required.

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