LFE2-20SE-6FN672I

The LFE2-20SE-6FN672I is an ECP2 family Field Programmable Gate Array (FPGA) supplied by Lattice Semiconductor Corporation. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count in a compact 672-BBGA package for industrial applications.

With 21,000 logic elements, approximately 0.283 Mbits of embedded memory, and 402 I/Os, this device is aimed at designs that require substantial integration and flexible I/O in an industrial temperature range and RoHS-compliant form factor.

Key Features

• Programmable Logic Capacity  21,000 logic elements to implement custom logic, state machines, and glue logic for diverse embedded designs.
• On‑Chip Memory  Approximately 0.283 Mbits of embedded RAM (282,624 total bits) for buffering, FIFOs, and local data storage.
• High I/O Count  402 user I/Os to support wide peripheral and bus connectivity without external multiplexing.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match system power domains and enable efficient power distribution.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Package and Mounting  672-BBGA (supplier device package: 672-FPBGA (27x27)) in a surface-mount format for high-density board integration.
• Regulatory Compliance  RoHS compliant for material and environmental conformity.

Typical Applications

• Industrial Control and Automation  Implement custom control logic, protocol bridging, and sensor aggregation using the device's logic and high I/O count within industrial temperature limits.
• Networking and Communications  Support interface aggregation and custom packet processing with abundant I/Os and on-chip memory for temporary buffering.
• Embedded System Integration  Act as a programmable glue logic and peripheral expander in compact systems where package density and surface-mount mounting are important.

Unique Advantages

• High Integration Density: 21,000 logic elements and 402 I/Os reduce the need for discrete glue logic and expand design flexibility.
• Embedded Memory On-Board: Approximately 0.283 Mbits of RAM enables local buffering and small data stores without external memory.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployments in industrial environments.
• Compact, High-Density Package: 672-BBGA (672-FPBGA (27x27)) surface-mount package supports dense PCB layouts and high pin counts.
• Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system designs for efficient power distribution.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs and supply chain compliance.

Why Choose LFE2-20SE-6FN672I?

The LFE2-20SE-6FN672I is positioned for engineers who need a mid-density FPGA solution with a high I/O count and on-chip memory in an industrial-grade package. Its combination of 21,000 logic elements, substantial I/O, and a compact 672-BBGA footprint makes it suitable for applications that require flexible, integrated programmable logic under challenging temperature conditions.

Backed by manufacturer documentation and RoHS compliance, this FPGA is appropriate for embedded and industrial designs that prioritize integration, configurable logic, and board-level density while maintaining standard regulatory alignment.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-20SE-6FN672I.