LFE2-20SE-6QN208I

IC FPGA 131 I/O 208QFP
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 131 282624 21000 208-BFQFP

Quantity 1,181 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusNot For New Designs
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O131Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20SE-6QN208I – ECP2 Field Programmable Gate Array (FPGA), 208-BFQFP

The LFE2-20SE-6QN208I is an industrial-grade FPGA from Lattice Semiconductor’s ECP2 family, delivered in a 208-pin BFQFP package. It provides a mid-range fabric with 21,000 logic elements, flexible on-chip memory and a rich I/O complement for embedded control, communications and signal-processing applications.

This device targets designs that require compact board-level integration and deterministic operation across an extended temperature range, while leveraging family-level features such as embedded DSP resources and programmable clocking blocks described in the Lattice ECP2 series documentation.

Key Features

  • Core Logic — 21,000 logic elements for implementing medium-complexity custom logic and control functions.
  • Programmable DSP Resources — ECP2 family sysDSP blocks are available for high-performance multiply-accumulate operations (ECP2-20 family-level configuration: 7 sysDSP blocks with 28 18×18 multipliers).
  • Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 276 Kbits) to support buffers, state machines and local data storage.
  • I/O and Interfaces — 131 user I/Os provided in the 208-pin BFQFP package to connect peripherals, sensors and external logic; the device supports a wide range of programmable I/O standards at the family level.
  • Clocking — Family-level clock management includes general-purpose PLLs and DLLs (ECP2-20 family-level: 2 GPLLs and 2 DLLs) for flexible clocking, phase and frequency management.
  • Power — Core supply operating range: 1.14 V to 1.26 V, enabling standard low-voltage FPGA core operation.
  • Package & Mounting — 208-BFQFP package case; supplier package referenced as 208-PQFP (28×28 mm). Surface-mount mounting type simplifies PCB assembly.
  • Industrial Temperature Rating — Specified operating range from −40 °C to 100 °C for reliable operation in industrial environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial Control and Automation — Implement deterministic I/O handling, custom control logic and local signal processing across an extended temperature range.
  • Signal Processing and Embedded DSP — Leverage sysDSP blocks and on-chip RAM for filtering, accumulation and other processing tasks in compact hardware implementations.
  • Interface Bridging and Custom Peripherals — Use the 131 I/Os and flexible I/O standards to bridge sensors, memory interfaces and legacy buses on a single FPGA fabric.
  • Communications and Networking Modules — Implement protocol adaptors, timing/clocking functions and packet preprocessing using the FPGA fabric and available clock-management resources.

Unique Advantages

  • Balanced mid-range logic capacity: 21,000 logic elements provide a practical balance of density and cost for medium-complexity designs.
  • On-chip DSP and multiplier resources: Family-level sysDSP blocks and multiple 18×18 multipliers enable efficient hardware acceleration of arithmetic-intensive tasks.
  • Extended operating temperature: −40 °C to 100 °C rating supports deployment in industrial and temperature-challenging environments.
  • Flexible clocking: Multiple PLL/DLL resources at the family level simplify clock distribution and phase adjustments for high-reliability systems.
  • Compact, assembly-ready package: 208-pin BFQFP surface-mount package suits space-constrained PCBs while providing 131 I/Os for system connectivity.
  • Industry-standard compliance: RoHS compliance supports use in regulated manufacturing environments.

Why Choose LFE2-20SE-6QN208I?

The LFE2-20SE-6QN208I positions itself as a versatile, industrial-grade FPGA solution for engineers needing a compact package with a substantive logic fabric, embedded memory and DSP capability. Its combination of 21,000 logic elements, dedicated DSP resources and flexible clocking is suited to control, interface and signal-processing designs where temperature resilience and board-level integration matter.

Designers benefit from the broader Lattice ECP2 family ecosystem and the documented family-level features—enabling predictable scalability and access to development tools and resources referenced in the ECP2 series documentation.

Request a quote or submit an inquiry to receive pricing and availability information, or to discuss how LFE2-20SE-6QN208I fits your next embedded FPGA design.

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