LFE2-20SE-7F256C

IC FPGA 193 I/O 256FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 193 282624 21000 256-BGA

Quantity 873 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O193Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20SE-7F256C – ECP2 FPGA, 21,000 Logic Elements, 256‑BGA

The LFE2-20SE-7F256C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor, supplied in a 256‑ball fpBGA (17 × 17 mm) package. It delivers a mid-range combination of logic density, on‑chip memory and I/O count suited for embedded systems and I/O‑intensive applications.

Designed for commercial‑grade applications, the device pairs approximately 21,000 logic elements with on‑chip RAM and dedicated DSP resources and provides flexible clocking and configuration features for system integration.

Key Features

  • Logic Capacity – Approximately 21,000 logic elements (cells) to implement mid‑sized FPGA designs and system integration tasks.
  • Embedded Memory – Total on‑chip RAM of 282,624 bits (approximately 0.283 Mbits) for local data storage, buffering and state retention.
  • DSP Resources – Family datasheet lists sysDSP blocks for multiply/accumulate functions; ECP2‑20 device-level DSP resources support high‑performance arithmetic acceleration.
  • I/O and Package – 193 external I/Os in a surface‑mount 256‑ball fpBGA (256‑FPBGA, 17 × 17 mm) package for dense board implementations and broad peripheral connectivity.
  • Clocking and Timing – General purpose and delay‑locked clock resources included in the ECP2 family (GPLLs and DLLs per device) to support complex clocking schemes and phase/deskew adjustments.
  • Power – Core supply range specified at 1.14 V to 1.26 V for system power budgeting and regulator selection.
  • Configuration and System Features – Family features include boundary‑scan (1149.1), SPI boot flash interface, dual boot image capability, TransFR I/O for field updates and an on‑chip oscillator for initialization.
  • Mounting and Grade – Surface mount fpBGA package; commercial grade operation from 0 °C to 85 °C.
  • Compliance – RoHS compliant.

Typical Applications

  • Embedded Control and Signal Processing – Use the device’s logic fabric, embedded RAM and DSP blocks for control algorithms, real‑time filtering and protocol processing.
  • High‑I/O System Interfaces – 193 I/Os in a compact fpBGA package enable board‑level designs requiring multiple parallel interfaces or mixed I/O standards.
  • Memory Interface and Buffering – On‑chip RAM supports local buffering, FIFO implementation and embedded state machines for system data flow.
  • Prototyping and System Integration – Mid‑range logic density and configuration flexibility make the part suitable for prototype platforms and integration into production electronics where a commercial temperature grade is appropriate.

Unique Advantages

  • Balanced Compute and Memory: Approximately 21,000 logic elements combined with ~282,624 bits of embedded memory lets you implement control, state and data buffering without excessive external RAM.
  • High I/O Count in a Compact Package: 193 I/Os in a 17 × 17 mm 256‑ball fpBGA reduce PCB area while supporting dense peripheral connectivity.
  • Dedicated DSP Support: Family‑level sysDSP resources provide multiply/accumulate capability to accelerate arithmetic‑intensive functions.
  • Flexible Clocking and Configuration: On‑device PLL/DLL clock resources and support for SPI boot and dual boot images simplify system bring‑up and in‑field updates.
  • Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation with RoHS compliance for mainstream electronics applications.
  • Low‑Voltage Core: Narrow core voltage range (1.14 V–1.26 V) eases power supply selection and system power planning.

Why Choose LFE2-20SE-7F256C?

The LFE2-20SE-7F256C positions as a mid‑range FPGA that balances logic density, embedded memory and a high I/O count in a compact fpBGA footprint. It is well suited for designers who need integrated DSP capability, flexible configuration options and on‑chip RAM for buffering and state storage, all within a commercial temperature envelope.

Backed by the Lattice ECP2 family feature set, the device offers a practical combination of resources for system designers targeting embedded control, interface consolidation and mid‑complexity signal processing tasks while keeping board area and BOM under control.

Request a quote or submit an inquiry to get pricing, availability and lead‑time information for the LFE2-20SE-7F256C. Our team can provide details to support procurement and design planning.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up