LFE2-20SE-7FN256C

The LFE2-20SE-7FN256C is a commercial-grade ECP2 family field programmable gate array (FPGA) supplied in a 256-BGA package. It provides a balanced combination of logic density, embedded RAM, and a high I/O count for board-level programmable logic designs.

With 21,000 logic elements, approximately 0.28 Mbits of on-chip RAM, and 193 I/O pins, this device is suited for commercial embedded systems that require compact packaging and low-voltage operation within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 21,000 logic elements organized across 2,625 CLBs, enabling moderate-density programmable logic implementation.
• Embedded Memory — Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support buffering, small data stores, and FPGA-based state machines.
• I/O Density — 193 user I/O pins to support complex interfacing and multiple peripheral connections on a single device.
• Power — Core supply range of 1.14 V to 1.26 V for low-voltage system integration.
• Package and Mounting — 256-ball BGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board layouts and high pin density.
• Operating Range — Commercial temperature rating from 0 °C to 85 °C suitable for typical commercial electronics environments.
• Regulatory — RoHS-compliant construction.

Typical Applications

• Commercial Embedded Systems — Implements custom logic, glue logic, and control functions where moderate logic capacity and on-chip RAM are required.
• Communications Equipment — Enables protocol bridging and interface aggregation using the device’s 193 I/O pins and programmable logic.
• Consumer Electronics — Handles feature control, peripheral management, and user interface logic in compact BGA packaging.
• Prototyping and Development — Useful for evaluating mid-density FPGA designs on development boards and early product prototypes.

Unique Advantages

• Balanced Logic and Memory: 21,000 logic elements paired with ~0.28 Mbits of on-chip RAM provides a practical mix for many commercial designs without external memory.
• High I/O Count: 193 I/O pins allow for multiple peripherals and interfaces to be integrated directly into the FPGA fabric, reducing external glue logic.
• Compact, High-Density Package: 256-ball FPBGA (17 × 17 mm) enables board space savings while maintaining a high pin count for complex routing.
• Low-Voltage Core: 1.14 V to 1.26 V core supply supports energy-efficient system designs and modern power architectures.
• Commercial Temperature and RoHS Compliance: 0 °C to 85 °C rating and RoHS compliance meet common commercial product and regulatory needs.

Why Choose LFE2-20SE-7FN256C?

The LFE2-20SE-7FN256C positions itself as a compact, mid-density FPGA option for commercial designs that need substantial I/O, a solid logic element count, and embedded RAM in a small BGA footprint. Its combination of 21,000 logic elements, approximately 0.28 Mbits of on-chip memory, and 193 I/Os makes it a practical choice for developers implementing custom logic, interface bridging, and control functions without excessive board area.

Designed for commercial applications, this device offers a clear value proposition for engineering teams seeking scalable programmable logic, RoHS compliance, and straightforward integration into 0 °C to 85 °C environments. It is well suited to projects where compact packaging and a balanced set of resources reduce BOM complexity and simplify system architecture.

Request a quote or submit an inquiry to begin sourcing the LFE2-20SE-7FN256C for your next commercial FPGA design project.