LFE2-20SE-7F484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA |
|---|---|
| Quantity | 69 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2625 | Number of Logic Elements/Cells | 21000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFE2-20SE-7F484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA
The LFE2-20SE-7F484C is an ECP2 Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-temperature embedded designs. It integrates a mid-range logic fabric with on-chip RAM and a high I/O count to support applications that require programmable logic, flexible interfacing, and moderate embedded memory.
Built in a 484-BBGA (484-FPBGA, 23×23) surface-mount package and operating from a 1.14 V to 1.26 V supply, this device targets designs that need a balance of logic capacity, I/O density, and compact packaging within a 0 °C to 85 °C operating range.
Key Features
- Core Logic 2,625 CLBs providing a total of 21,000 logic elements for implementing combinational and sequential logic.
- Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for data buffering, lookup tables, and small memory structures.
- I/O Capacity 331 general-purpose I/O pins to support extensive external interfacing and multiple parallel connections.
- Power Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support energy-conscious designs.
- Package & Mounting 484-BBGA package (listed as 484-FPBGA, 23×23) in a surface-mount form factor for compact board-level integration.
- Operational Grade & Temperature Commercial grade device rated for operation from 0 °C to 85 °C.
- Environmental RoHS compliant.
Typical Applications
- Embedded Systems With 21,000 logic elements and on-chip RAM, suitable for implementing custom logic functions and control engines in embedded platforms.
- High‑I/O Interface Designs 331 I/O pins enable bridging and interfacing between multiple peripherals, sensors, and external controllers.
- Prototyping and Development Mid-density logic and a compact 484-BBGA package make the device appropriate for prototyping system-level logic and validating hardware architectures.
Unique Advantages
- Balanced Logic and Memory: 21,000 logic elements paired with 282,624 bits of on-chip RAM provide designers flexibility to implement both control logic and local data storage without immediately relying on external memory.
- High I/O Count: 331 I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-peripheral systems.
- Compact Surface-Mount Package: The 484-BBGA (484-FPBGA, 23×23) package supports space-constrained PCBs while maintaining a high pin count.
- Low-Voltage Core: A narrow core supply range of 1.14 V to 1.26 V enables designs that target lower-power operation within the specified commercial temperature range.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements for many commercial products.
Why Choose LFE2-20SE-7F484C?
The LFE2-20SE-7F484C delivers a practical combination of mid-range logic capacity, on-chip memory, and substantial I/O count in a compact 484-BBGA surface-mount package. It is positioned for engineers who need a programmable logic device that balances integration and board-level density for commercial-temperature embedded applications.
This device suits designs that require scalable logic resources, extensive external interfacing, and RoHS compliance, offering clear value for systems where moderate logic density and a high number of I/Os are primary requirements.
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