LFE2-20SE-7FN484C

IC FPGA 331 I/O 484FBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

Quantity 451 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O331Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2625Number of Logic Elements/Cells21000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFE2-20SE-7FN484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 282624 21000 484-BBGA

The LFE2-20SE-7FN484C is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor that provides a mid-range logic fabric for embedded designs. It combines 21,000 logic elements with 331 I/O pins and approximately 0.28 Mbits of embedded memory (282,624 bits) in a compact ball-grid array package.

Designed for surface-mount assembly, this device is supplied in a 484-BBGA (484-FPBGA, 23×23) package, operates from a 1.14 V to 1.26 V core supply, and is specified for commercial temperature operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Logic Capacity — 21,000 logic elements provide a substantial programmable fabric for combinational and sequential logic implementations.
  • Embedded Memory — Approximately 0.28 Mbits of on-chip RAM (282,624 bits) for data buffering, state storage, and small lookup tables.
  • I/O Density — 331 general-purpose I/O pins to support multiple external interfaces and parallel connectivity requirements.
  • Package and Mounting — 484-BBGA (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for space-efficient PCB layouts.
  • Power — Core supply range of 1.14 V to 1.26 V to match modern low-voltage power domains.
  • Operating Conditions — Commercial temperature grade rated from 0 °C to 85 °C for standard electronics environments.
  • Regulatory — RoHS compliant materials and manufacturing.

Unique Advantages

  • Balanced Logic and Memory: The combination of 21,000 logic elements and embedded RAM supports complex logic functions with local storage without external memory for many use cases.
  • High I/O Count: With 331 I/O pins, the device enables dense external interfacing for systems requiring multiple peripherals or parallel data paths.
  • Compact BGA Footprint: The 484-BBGA (23×23) package delivers significant integration in a compact, surface-mount form factor to save PCB area.
  • Low-Voltage Core: A defined 1.14 V to 1.26 V supply range supports integration into modern low-voltage power architectures.
  • Commercial Temperature Rating: Specified operation from 0 °C to 85 °C suits standard commercial electronic products and development environments.
  • RoHS Compliance: Meets RoHS requirements for lead-free assembly and environmental compliance.

Why Choose LFE2-20SE-7FN484C?

The LFE2-20SE-7FN484C is positioned for designers who need a mid-range FPGA solution that balances logic element count, on-chip memory, and a high I/O count in a compact BGA package. Its defined core voltage range, surface-mount 484-BBGA package, and commercial temperature rating make it suitable for a wide range of standard embedded electronic designs.

Manufactured by Lattice Semiconductor, this FPGA offers a clear set of electrical and mechanical specifications—logic capacity, memory size, I/O count, supply range, package detail, and RoHS compliance—allowing engineers and procurement teams to evaluate system fit and lifecycle requirements with concrete, verifiable data.

Request a quote or submit an inquiry to obtain pricing and availability for the LFE2-20SE-7FN484C. Our team will respond with ordering information and lead-time details.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up