LFE2-20SE-7Q208C

The LFE2-20SE-7Q208C is a Lattice ECP2 family Field Programmable Gate Array (FPGA) offered in a 208‑pin BFQFP surface-mount package. It provides a mid-range logic capacity and on-chip memory suitable for embedded control, interface bridging, and moderate-complexity signal processing tasks.

Designed for commercial applications, this device combines 21,000 logic elements, 131 general-purpose I/Os, and embedded RAM to simplify board-level integration while operating from a low-voltage core supply of 1.14 V to 1.26 V.

Key Features

• Logic Capacity — 21,000 logic elements for implementing combinational and sequential logic, state machines, and glue logic in a single device.
• Embedded Memory — Approximately 282,624 total RAM bits (≈0.28 Mbits) of on-chip memory for FIFOs, buffering, and small data stores.
• I/O Count — 131 I/O pins to support multiple peripheral interfaces and board-level connectivity in the 208‑pin package.
• Package & Mounting — 208‑BFQFP package (supplier package: 208‑PQFP, 28×28 mm) optimized for surface-mount assembly and compact board footprints.
• Power — Low-voltage core supply range from 1.14 V to 1.26 V to support power-sensitive designs.
• Operating Range — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS‑compliant for meet environmental and assembly requirements.
• Family-Level Capabilities — As part of the Lattice ECP2 family, the device is aligned with architecture features such as flexible memory resources, sysDSP blocks, and programmable PLL/DLL clocking available across the family.

Typical Applications

• Embedded Control — Implement system control logic, multiplexing, and protocol handling using the device’s 21,000 logic elements and on-chip RAM.
• Interface Bridging — Use the 131 I/Os to bridge between microcontrollers, sensors, and external peripherals while consolidating glue logic.
• Memory Interface and Buffering — Employ the embedded RAM for temporary data storage, buffering and FIFO functions in memory-interfacing designs.
• Signal Processing Acceleration — Offload moderate DSP and arithmetic tasks to FPGA fabric using the available logic and embedded memory resources.

Unique Advantages

• Balanced Logic and Memory — 21,000 logic elements combined with ~0.28 Mbits of embedded RAM provide a compact platform for multi-function designs without external memory for small buffers.
• High I/O Density in a Compact Package — 131 I/Os in a 208‑BFQFP package deliver substantial board-level connectivity while preserving a manageable PCB footprint.
• Low-Voltage Core — 1.14 V to 1.26 V core supply supports designs targeting lower power consumption at the FPGA core.
• Commercial Temperature Grade — Specified for 0 °C to 85 °C operation, suitable for mainstream industrial, consumer, and communications equipment operating within that range.
• RoHS Compliant — Meets RoHS requirements for lead‑free assembly and environmental compliance.
• Family Ecosystem — Leveraging the Lattice ECP2 family architecture enables reuse of design techniques and family-level features such as programmable clocking and enhanced DSP resources.

Why Choose LFE2-20SE-7Q208C?

The LFE2-20SE-7Q208C positions itself as a practical FPGA choice for developers needing a balance of logic density, on-chip memory, and I/O in a surface-mount 208‑pin package. Its combination of 21,000 logic elements, 131 I/Os, and approximately 282,624 bits of embedded RAM makes it well-suited for embedded control, interface consolidation, and signal-processing acceleration within commercial-temperature environments.

For teams seeking predictable power characteristics and compact integration, this ECP2 device offers a clear platform to scale designs within the Lattice ECP2 family and take advantage of family-level architecture and development flows.

If you’d like pricing, availability, or to request a quote for LFE2-20SE-7Q208C, submit a sales inquiry and our team will respond with the next steps.