LFE2-35E-5F672I

The LFE2-35E-5F672I is an ECP2 family FPGA IC from Lattice Semiconductor Corporation configured in a 672-ball BGA package. It provides a programmable logic fabric with 32,000 logic elements, substantial on-chip RAM, and a high I/O count for dense system integration.

This industrial-grade device is supplied in a surface-mount 672-FPBGA (27×27) package, supports a core supply range of 1.14 V to 1.26 V, and is rated for operation from −40 °C to 100 °C. These characteristics make it suitable for embedded designs that require significant logic capacity, embedded memory, and high I/O connectivity within a compact package.

Key Features

• Logic Capacity  32,000 logic elements provide a substantial programmable fabric for implementing custom logic, data paths, and control functions.
• Embedded Memory  Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for buffering, packet storage, or local data structures.
• I/O Density  Up to 450 I/O pins to support a broad range of external interfaces and parallel connections to peripherals and sensors.
• Package & Mounting  672-ball BGA in a 672-FPBGA (27×27) footprint; surface-mount package suited to board-level integration in space-constrained designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulator designs.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, enabling deployment in industrial environments.
• RoHS Compliant  Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control  Implementation of custom control logic, signal conditioning, and real-time I/O aggregation in factory automation and PLC systems.
• High-Density I/O Systems  Multi-channel interface boards and sensor hubs that require large numbers of configurable I/O lines and local logic processing.
• Embedded Memory Buffering  Local buffering and packet staging for communication modules or data acquisition systems using the device's embedded RAM.
• Custom Logic Acceleration  Offloading application-specific processing tasks into programmable logic to consolidate discrete components and reduce board-level BOM.

Unique Advantages

• High Logic Density: 32,000 logic elements allow consolidation of multiple functions into a single programmable device, reducing component count.
• Substantial On-Chip RAM: Approximately 0.34 Mbits of embedded memory supports buffering and local data storage without external memory.
• Extensive I/O Count: With up to 450 I/O pins, the part supports complex, multi-signal interfaces and simplifies board routing for dense applications.
• Industrial Temperature Range: −40 °C to 100 °C rating enables reliable operation in a wide range of field environments.
• Compact BGA Package: 672-ball FPBGA (27×27) combines high pin count with a compact footprint for space-constrained system designs.
• RoHS Compliance: Meets environmental and manufacturing requirements for lead-free assembly.

Why Choose LFE2-35E-5F672I?

The LFE2-35E-5F672I positions itself as a solid option for designers needing a balance of logic capacity, embedded memory, and very high I/O density in a single, industrial-grade FPGA. Its combination of 32,000 logic elements, approximately 0.34 Mbits of RAM, and up to 450 I/O facilitates consolidation of system functions and streamlines board-level integration.

This device is well suited to engineering teams working on industrial automation, communication interfaces, and embedded control platforms that demand a compact BGA package, industrial temperature performance, and RoHS-compliant manufacturing. As part of the ECP2 product family from Lattice Semiconductor Corporation, it fits designs that prioritize scalable programmable logic and on-chip resources for long-term deployment.

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