LFE2-35E-5FN672C

IC FPGA 450 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA

Quantity 758 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BBGANumber of I/O450Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35E-5FN672C – ECP2 Field Programmable Gate Array (FPGA) IC 672-BBGA

The LFE2-35E-5FN672C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade programmable logic applications. It provides a balance of logic capacity, embedded memory, and a high I/O count in a compact 672-ball BGA package.

With 32,000 logic elements, approximately 0.34 Mbits of embedded memory and up to 450 I/O, this device targets designs that require dense FPGA logic and extensive external interfacing while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

  • Core Logic  Provides 32,000 logic elements to implement complex programmable logic and custom digital functions.
  • Embedded Memory  Includes approximately 0.34 Mbits (339,968 bits) of on-chip RAM for buffering, packet storage, and small data structures.
  • High I/O Count  Up to 450 I/O pins to support extensive external device interfacing and high-pin-count system designs.
  • Supply Voltage  Operates from 1.14 V to 1.26 V, enabling integration with low-voltage system domains.
  • Package and Mounting  Available in a 672-ball BGA (supplier device package 672-FPBGA, 27×27) with surface-mount mounting for dense PCB implementations.
  • Operating Range  Commercial grade operation specified from 0 °C to 85 °C for standard commercial deployments.
  • Environmental Compliance  RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

  • High-density digital logic  Use the 32,000 logic elements to implement custom state machines, protocol processors, and glue logic that require substantial programmable resources.
  • Buffering and small data storage  Leverage approximately 0.34 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary data storage.
  • Multi-interface systems  Deploy the device in systems needing many external connections—up to 450 I/O—to interface with peripherals, sensors, or external memories.
  • Compact, PCB-dense designs  The 672-BBGA (27×27) package and surface-mount mounting suit space-constrained boards where high integration is required.

Unique Advantages

  • High logic density: 32,000 logic elements allow substantial on-chip implementation of custom logic without immediately resorting to external ASICs or additional FPGAs.
  • Meaningful on-chip memory: Approximately 0.34 Mbits of embedded RAM reduces dependence on external memory for short-term storage and buffering.
  • Extensive I/O availability: Up to 450 I/O pins simplify system partitioning and minimize the need for additional I/O expanders.
  • Compact BGA packaging: The 672-BBGA (672-FPBGA, 27×27) package supports high-density board layouts while maintaining a conventional BGA assembly flow.
  • Commercial operating range: Specified 0 °C to 85 °C operation aligns with general-purpose electronic products and standard commercial deployments.
  • RoHS compliant: Meets common environmental requirements for lead-free manufacturing processes.

Why Choose LFE2-35E-5FN672C?

The LFE2-35E-5FN672C combines substantial logic capacity, meaningful embedded memory, and a very high I/O count in a single commercial-grade FPGA package from Lattice Semiconductor Corporation. Its 672-ball BGA footprint and surface-mount mounting make it suitable for compact, high-density PCB designs that require significant programmable resources and extensive external interfacing.

This device is well suited for designers and teams building mid-range programmable logic solutions who need a balance of logic elements, on-chip RAM, and I/O without stepping up to larger FPGA families. Its defined voltage and temperature ranges, along with RoHS compliance, support standard commercial product lifecycles and manufacturing flows.

Request a quote or submit an inquiry to check availability and pricing for LFE2-35E-5FN672C and to discuss how this FPGA can fit your design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up