LFE2-35E-5FN672C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 758 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35E-5FN672C – ECP2 Field Programmable Gate Array (FPGA) IC 672-BBGA
The LFE2-35E-5FN672C is an ECP2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial-grade programmable logic applications. It provides a balance of logic capacity, embedded memory, and a high I/O count in a compact 672-ball BGA package.
With 32,000 logic elements, approximately 0.34 Mbits of embedded memory and up to 450 I/O, this device targets designs that require dense FPGA logic and extensive external interfacing while operating within a 1.14 V to 1.26 V supply range and a 0 °C to 85 °C commercial temperature window.
Key Features
- Core Logic Provides 32,000 logic elements to implement complex programmable logic and custom digital functions.
- Embedded Memory Includes approximately 0.34 Mbits (339,968 bits) of on-chip RAM for buffering, packet storage, and small data structures.
- High I/O Count Up to 450 I/O pins to support extensive external device interfacing and high-pin-count system designs.
- Supply Voltage Operates from 1.14 V to 1.26 V, enabling integration with low-voltage system domains.
- Package and Mounting Available in a 672-ball BGA (supplier device package 672-FPBGA, 27×27) with surface-mount mounting for dense PCB implementations.
- Operating Range Commercial grade operation specified from 0 °C to 85 °C for standard commercial deployments.
- Environmental Compliance RoHS compliant to meet common lead-free manufacturing requirements.
Typical Applications
- High-density digital logic Use the 32,000 logic elements to implement custom state machines, protocol processors, and glue logic that require substantial programmable resources.
- Buffering and small data storage Leverage approximately 0.34 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary data storage.
- Multi-interface systems Deploy the device in systems needing many external connections—up to 450 I/O—to interface with peripherals, sensors, or external memories.
- Compact, PCB-dense designs The 672-BBGA (27×27) package and surface-mount mounting suit space-constrained boards where high integration is required.
Unique Advantages
- High logic density: 32,000 logic elements allow substantial on-chip implementation of custom logic without immediately resorting to external ASICs or additional FPGAs.
- Meaningful on-chip memory: Approximately 0.34 Mbits of embedded RAM reduces dependence on external memory for short-term storage and buffering.
- Extensive I/O availability: Up to 450 I/O pins simplify system partitioning and minimize the need for additional I/O expanders.
- Compact BGA packaging: The 672-BBGA (672-FPBGA, 27×27) package supports high-density board layouts while maintaining a conventional BGA assembly flow.
- Commercial operating range: Specified 0 °C to 85 °C operation aligns with general-purpose electronic products and standard commercial deployments.
- RoHS compliant: Meets common environmental requirements for lead-free manufacturing processes.
Why Choose LFE2-35E-5FN672C?
The LFE2-35E-5FN672C combines substantial logic capacity, meaningful embedded memory, and a very high I/O count in a single commercial-grade FPGA package from Lattice Semiconductor Corporation. Its 672-ball BGA footprint and surface-mount mounting make it suitable for compact, high-density PCB designs that require significant programmable resources and extensive external interfacing.
This device is well suited for designers and teams building mid-range programmable logic solutions who need a balance of logic elements, on-chip RAM, and I/O without stepping up to larger FPGA families. Its defined voltage and temperature ranges, along with RoHS compliance, support standard commercial product lifecycles and manufacturing flows.
Request a quote or submit an inquiry to check availability and pricing for LFE2-35E-5FN672C and to discuss how this FPGA can fit your design requirements.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
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