LFE2-35E-6F484I

The LFE2-35E-6F484I is a Lattice Semiconductor ECP2 family Field Programmable Gate Array (FPGA) supplied in a 484-ball BGA package. It delivers a balance of programmable logic, on-chip memory and high I/O density for industrial embedded and communications applications.

Designed for system integration, this device offers 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, up to 331 I/Os and support for low-voltage core operation, making it suitable for industrial-grade designs requiring moderate logic capacity and a large I/O footprint.

Key Features

• Programmable Logic – 32,000 logic elements for implementing medium-complexity digital designs.
• Embedded Memory – Approximately 0.34 Mbits (339,968 bits) of on-chip RAM for data buffering and small software/firmware storage.
• High I/O Count – 331 user I/Os to support dense peripheral and interface routing in compact designs.
• Industrial Temperature Range – Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Low-Voltage Core – Core supply range from 1.14 V to 1.26 V to match system power domains and minimize power dissipation.
• Packaging & Mounting – 484-ball BBGA package (supplier package: 484-FPBGA, 23 × 23 mm) with surface-mount mounting for modern PCB assembly.
• Family-Level Capabilities (LatticeECP2/M) – Family data highlights include advanced DSP blocks (sysDSP), flexible embedded block RAM (EBR), PLLs/DLLs for clocking and source-synchronous I/O support—features available across the LatticeECP2/M series.
• Compliance – RoHS-compliant for environmental and regulatory support in production systems.

Typical Applications

• Industrial Control – Implement real-time I/O aggregation, protocol bridging and control logic within the industrial temperature range and high I/O count.
• Communications Equipment – Use the device for mid-range packet processing, interface bridging and peripheral connectivity that require many I/Os and embedded memory.
• Embedded Systems – Integrate custom logic, timing and memory resources for compact embedded platforms and instrumentation.
• Prototyping & System Integration – Leverage the ECP2 family architecture and available design tools to prototype and scale designs across higher or lower density family members.

Unique Advantages

• High Logic Density: 32,000 logic elements enables medium-complexity designs without moving to larger, more costly devices.
• Large I/O Capacity: 331 I/Os provide flexibility to connect many sensors, transceivers and peripherals directly to the device.
• Industrial Reliability: Specified for −40 °C to 100 °C operation to meet demanding industrial environmental requirements.
• Compact BGA Package: 484-ball BBGA (23 × 23 mm) minimizes PCB area while supporting high pin count and surface-mount assembly.
• Low-Voltage Operation: 1.14 V to 1.26 V core supply supports modern low-power system architectures.
• RoHS Compliance: Supports environmentally conscious manufacturing and regulatory compliance.

Why Choose LFE2-35E-6F484I?

The LFE2-35E-6F484I positions itself as a practical choice for industrial and communications-focused designs that need a mid-range FPGA with substantial I/O, reasonable embedded memory and robust operating-temperature capability. Its place in the Lattice ECP2 family means designers can take advantage of family-level features—such as advanced DSP blocks, flexible embedded RAM and on-chip clocking resources—when mapping system functions to silicon.

This device is suitable for development teams and procurement groups seeking a compact, industrial-grade FPGA that balances integration, scalability and supplier ecosystem support through the ECP2 family design flow.

Request a quote or submit a purchase inquiry to begin procurement of the LFE2-35E-6F484I for your next design.