LFE2-35E-6FN484C

The LFE2-35E-6FN484C is an ECP2 family Field Programmable Gate Array (FPGA) in a 484-ball BGA package, offered as a commercial-grade, surface-mount device. It provides a balanced combination of programmable logic capacity, embedded memory, and a high I/O count for integration into commercial electronic designs.

Key device attributes include 32,000 logic elements, approximately 0.34 Mbits of embedded memory, 331 I/O, a 1.14 V to 1.26 V core supply range, RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  32,000 logic elements suitable for implementing medium-complexity digital logic and control functions.
• Embedded Memory  Approximately 0.34 Mbits of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Count  331 available I/O pins to support a wide range of peripheral interfaces and parallel connections.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting  484-ball FBGA package (23 × 23 mm footprint) in a surface-mount form factor for compact PCB integration.
• Operational Range  Commercial-grade operation from 0 °C to 85 °C for typical commercial-environment applications.
• Regulatory  RoHS compliant construction for lead-free manufacturing processes.

Typical Applications

• Commercial embedded systems  Use as programmable logic in commercial devices that require moderate logic density and flexible I/O.
• Custom digital logic and prototyping  Implement custom state machines, signal routing, and glue logic during development and production stages.
• I/O-intensive control and interface tasks  High I/O count supports multiple peripheral connections, parallel interfaces and board-level aggregation.
• Low-voltage programmable designs  Suited for systems operating within the specified 1.14 V–1.26 V core supply range.

Unique Advantages

• Substantial logic resources: 32,000 logic elements provide headroom for medium-complexity designs without external logic expansion.
• On-chip RAM for local storage: Approximately 0.34 Mbits of embedded memory reduces dependence on external SRAM for small buffers and LUTs.
• High I/O density: 331 I/O pins enable flexible board-level interfacing and multiple parallel connections from a single device.
• Compact BGA package: 484-ball FBGA (23 × 23 mm) minimizes PCB area while supporting surface-mount assembly processes.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance to meet standard commercial manufacturing and deployment requirements.
• Defined low-voltage operation: Narrow core supply range (1.14 V–1.26 V) supports designs targeting specific low-voltage power architectures.

Why Choose LFE2-35E-6FN484C?

The LFE2-35E-6FN484C positions itself as a versatile commercial-grade FPGA option that combines a substantial pool of logic elements, meaningful embedded memory, and a high I/O count in a compact 484-BBGA package. These characteristics make it well suited for designers seeking integrated programmable logic with significant interfacing capability in space-constrained PCBs.

This part is appropriate for engineering teams and procurement looking for a commercially specified FPGA that balances integration, I/O capacity, and compact packaging. Its RoHS compliance and defined operating conditions support standard commercial production and deployment scenarios.

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