LFE2-35E-6FN672I

The LFE2-35E-6FN672I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation built on the ECP2 family architecture. It provides a balanced combination of logic capacity, embedded memory, and a high I/O count for designs that need on-chip programmability and board-level integration.

With 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and up to 450 I/O, this surface-mount device targets industrial applications and systems that require significant connectivity, moderate on-chip storage, and operation across a wide temperature range.

Key Features

• Core Logic  32,000 logic elements for implementing complex combinational and sequential logic functions.
• Embedded Memory  Approximately 0.34 Mbits of on-chip RAM to support buffering, LUTs, and state storage within logic designs.
• I/O Density  Up to 450 general-purpose I/O pins to support multi‑port interfaces and extensive board-level connectivity.
• Package & Mounting  672-BBGA (supplier device package: 672-FPBGA, 27×27) in a surface-mount format for compact board integration.
• Power  Core voltage supply specified between 1.14 V and 1.26 V to define system power-domain requirements.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C suitable for industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Leverages industrial temperature rating and 32,000 logic elements for control logic, signal processing, and interface consolidation in automation equipment.
• High‑Density I/O Systems  Uses the 450 I/O pins for applications that require extensive sensor/actuator or multi‑port connectivity on a single FPGA.
• Embedded Memory‑Centric Logic  Approximately 0.34 Mbits of embedded RAM supports buffering and small data‑storage requirements within custom logic blocks.

Unique Advantages

• High Logic Capacity: 32,000 logic elements enable implementation of substantial custom logic without external programmable devices.
• Significant I/O Integration: 450 I/O pins reduce the need for additional interface chips and simplify board-level routing for complex systems.
• On‑Chip Memory: Approximately 0.34 Mbits of embedded memory provides local storage for buffering and lookup needs, decreasing external memory dependence.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suited to industrial environments and extended temperature deployments.
• Compact BGA Package: 672-BBGA (27×27) surface-mount package offers a high pin count in a compact footprint for space-constrained designs.
• Controlled Core Voltage: Narrow supply range (1.14–1.26 V) aids in predictable power-domain planning and thermal management.

Why Choose LFE2-35E-6FN672I?

The LFE2-35E-6FN672I positions itself as a mid‑density FPGA option that balances logic capacity, embedded memory, and extensive I/O in a single industrial‑grade package. It is well suited to engineers designing industrial control systems, high‑I/O interface platforms, and applications that require reliable operation across a wide temperature range.

Delivered by Lattice Semiconductor Corporation and packaged in a 672-BBGA surface-mount format, this device offers a concise set of capabilities—32,000 logic elements, approximately 0.34 Mbits of on‑chip RAM, and 450 I/O—that supports scalable custom logic implementations while simplifying board integration and BOM complexity.

Request a quote or submit an inquiry today to check pricing and availability for the LFE2-35E-6FN672I.