LFE2-35E-7FN672C

The LFE2-35E-7FN672C is a commercial-grade ECP2 family FPGA in a 672-ball BGA package, optimized for system integration and programmable logic tasks. It delivers 32,000 logic elements, extensive on-chip memory and high I/O density—making it suitable for mid-density embedded applications that require flexible logic, plentiful I/O and compact surface-mount packaging.

Designed for applications that need significant logic capacity and connectivity in a 27 × 27 mm fpBGA footprint, the device provides a balance of performance and integration for industrial, communications and general embedded use within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 32,000 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 0.34 Mbits of on-chip RAM (339,968 bits) for tables, buffers and state storage.
• I/O Density — Up to 450 user I/Os to support wide peripheral, bus and high-pin-count interface requirements.
• Package & Mounting — 672-BBGA package (672-FPBGA, 27 × 27 mm) for compact, high-density surface-mount board designs.
• Power — Core supply range specified at 1.14 V to 1.26 V for predictable power planning and supply design.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• System Resources (family-level) — Built on the Lattice ECP2 family architecture, which includes advanced DSP blocks, flexible embedded block RAM and distributed RAM, and multiple PLL/DLL clock resources to support system timing and signal processing (family features).
• Configuration & Reliability (family-level) — Family-level support for flexible device configuration options such as SPI boot flash interface, boundary-scan and features that aid field updates and in-system debugging (family features).
• Compliance — RoHS compliant for lead-free assembly processes.

Typical Applications

• Packet and Protocol Bridging — Use the device’s high I/O count and logic capacity for protocol conversion, front-end packet processing, and interconnect bridging functions.
• Embedded System Control — Implement custom control logic, state machines and peripheral interfaces in compact, surface-mount designs.
• High‑Density I/O Aggregation — Consolidate multiple I/O functions and glue logic in applications that require many GPIOs or mixed signaling banks.
• Signal Processing Acceleration — Leverage the family’s DSP resources and on-chip RAM to offload and accelerate deterministic signal-processing tasks at the hardware level.

Unique Advantages

• High Logic Integration: 32,000 logic elements enable complex designs without external glue logic, reducing BOM and board area.
• Substantial On‑Chip Memory: Roughly 0.34 Mbits of embedded RAM supports buffering, lookup tables and local data storage to improve throughput and determinism.
• Large I/O Count in a Compact Package: 450 I/Os in a 27 × 27 mm fpBGA allow dense connectivity while keeping the PCB footprint constrained.
• Predictable Power Envelope: Defined core supply range (1.14 V–1.26 V) simplifies power-supply selection and thermal planning.
• Commercial Temperature Support: Rated 0 °C to 85 °C for designs targeting commercial and industrial-adjacent applications that meet that range.
• Ecosystem and Family-Level Capabilities: Based on the Lattice ECP2 architecture which provides DSP blocks, embedded RAM options and clocking resources to accelerate system design and integration.

Why Choose LFE2-35E-7FN672C?

This FPGA delivers a balanced mix of logic density, memory and I/O in a surface-mount 672-ball BGA package, making it a practical choice for mid-range embedded designs requiring substantial programmable resources without a large package footprint. Its commercial-grade operating range, RoHS compliance and defined supply voltage simplify system integration and production planning.

Designers seeking scalable logic capacity, flexible on-chip memory and a high pin count for complex interfacing will find the LFE2-35E-7FN672C suitable for a wide range of applications where integration, connectivity and predictable power requirements matter.

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