LFE2-35SE-5F484I

The LFE2-35SE-5F484I is an ECP2 series FPGA IC offering programmable logic capacity and embedded memory in a compact ball-grid package. It integrates 32,000 logic elements and approximately 0.34 Mbits of on-chip RAM to support custom digital functions and I/O‑dense designs.

Specified for industrial operation and surface-mount assembly, this device is targeted at systems that require high I/O count and reliable operation across a wide temperature range.

Key Features

• Logic Capacity — 32,000 logic elements to implement a wide range of custom digital architectures and logic functions.
• Embedded Memory — Approximately 0.34 Mbits of total on-chip RAM (339,968 bits) for buffering, state storage, and memory-mapped logic.
• I/O Density — 331 available I/O pins to support multiple interfaces, sensors, and external devices in high‑connectivity systems.
• Power Supply — Operates from a core voltage supply of 1.14 V to 1.26 V, suitable for low‑voltage digital domains.
• Package and Mounting — 484-BBGA package (supplier device package 484-FPBGA, 23×23) in a surface-mount form factor for space-constrained PCB designs.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet demanding environmental conditions.
• Compliance — RoHS compliant, supporting lead‑free manufacturing processes.

Typical Applications

• Industrial Control and Automation — Implement custom control logic and I/O interfacing with the industrial temperature rating and high I/O count.
• High‑Density I/O Systems — Support systems that require many external connections, such as data acquisition front ends or multi‑sensor hubs, using 331 I/Os.
• Embedded Memory‑Centric Functions — Use on‑chip RAM for buffering, packet staging, or local data storage in custom digital subsystems.

Unique Advantages

• High Logic Integration: 32,000 logic elements provide room for complex custom logic while keeping the design on a single FPGA.
• Substantial On‑Chip RAM: Approximately 0.34 Mbits of embedded memory reduces reliance on external RAM for many buffering and state tasks.
• Extensive I/O Capability: 331 I/Os enable direct connection to multiple peripherals and sensors without immediate need for I/O expanders.
• Industrial Reliability: Rated −40°C to 100°C and industrial grade for deployment in temperature-challenging environments.
• Compact BBGA Packaging: 484-BBGA (484-FPBGA, 23×23) minimizes PCB footprint while providing the pin density required for complex designs.
• RoHS Compliant: Supports lead‑free manufacturing and environmental compliance requirements.

Why Choose LFE2-35SE-5F484I?

The LFE2-35SE-5F484I delivers a balanced combination of logic density, embedded memory, and extensive I/O in a compact ball‑grid package engineered for industrial environments. Its voltage and temperature specifications make it suitable for designs that must operate reliably across a wide range of conditions while maintaining a high level of integration.

This part is well suited to engineers developing industrial control, high‑connectivity embedded systems, or any application that benefits from significant on‑chip logic and memory without a large PCB footprint.

Request a quote or submit an inquiry to receive pricing and availability for LFE2-35SE-5F484I and to discuss how this FPGA can fit into your next design.