LFE2-35SE-5F672I
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA |
|---|---|
| Quantity | 829 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA | Number of I/O | 450 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-5F672I – ECP2 Field Programmable Gate Array (FPGA), 672-BBGA
The LFE2-35SE-5F672I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2 family. It delivers reprogrammable logic, embedded memory, and a large I/O count in a compact 672-ball BGA package.
Designed for industrial-grade embedded designs, this device combines substantial logic capacity and on-chip RAM with a wide operating temperature range and RoHS compliance, making it suitable for demanding system-level deployments that require reliable, reconfigurable logic resources.
Key Features
- FPGA Core Field Programmable Gate Array architecture providing reprogrammable logic for custom hardware functions.
- Logic Capacity 32,000 logic elements and 4,000 logic blocks to implement complex combinational and sequential logic.
- On-Chip Memory Approximately 0.34 Mbits of embedded memory (339,968 total RAM bits) for buffering, state storage, and data processing.
- High I/O Count 450 I/O pins to support wide interfacing and parallel connectivity to external devices and subsystems.
- Package and Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27×27 mm) with surface-mount assembly for compact PCB integration.
- Power Core voltage supply range of 1.14 V to 1.26 V to match system power rails and optimize power distribution.
- Industrial Temperature Range Specified operating temperature from −40°C to 100°C for reliable operation in harsh or wide-temperature environments.
- Regulatory RoHS compliant for environmental and regulatory conformity in commercial and industrial products.
Typical Applications
- Industrial Control Systems Implement custom control logic, I/O aggregation, and deterministic interfaces using the device’s industrial temperature rating and large I/O count.
- Embedded System Integration Use the 32,000 logic elements and on-chip RAM to offload algorithms, glue logic, and protocol handling within compact embedded designs.
- High‑Density I/O Platforms Leverage 450 I/Os for applications requiring broad sensor, actuator, or peripheral connectivity on a single FPGA.
- Custom Logic and Acceleration Deploy reconfigurable logic blocks and embedded memory to accelerate specific datapath functions or implement application-specific peripherals.
Unique Advantages
- Substantial Logic and Memory in One Device: 32,000 logic elements plus approximately 0.34 Mbits of RAM provide the resources needed for complex custom logic and buffering without external components.
- Large I/O Capacity: 450 I/Os enable high‑pin-count interfacing and reduce the need for additional I/O expanders.
- Industrial Reliability: −40°C to 100°C operating range supports deployment in temperature‑challenging environments.
- Compact, Surface‑Mount BGA Package: 672-ball FPBGA (27×27 mm) package balances high integration density with PCB space efficiency.
- RoHS Compliance: Environmentally compliant construction supports regulatory requirements for modern electronics manufacturing.
- Tight Core Voltage Range: 1.14 V to 1.26 V supply specification facilitates predictable power design and integration with system rails.
Why Choose LFE2-35SE-5F672I?
The LFE2-35SE-5F672I positions itself as an industrial-grade FPGA option that combines significant logic density, embedded memory, and a very high I/O count in a compact 672-BBGA footprint. Its operating temperature range and RoHS compliance make it suitable for robust embedded and industrial designs where reliability and integration matter.
Choose this device when your design requires a balance of reconfigurable hardware capacity, on-chip memory, and broad connectivity in a surface-mount package that supports deployment across a wide temperature envelope.
Request a quote or submit an inquiry today to get pricing and availability for the LFE2-35SE-5F672I.

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