LFE2-35SE-5F672I

IC FPGA 450 I/O 672FPBGA
Part Description

ECP2 Field Programmable Gate Array (FPGA) IC 450 339968 32000 672-BBGA

Quantity 829 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package672-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGANumber of I/O450Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4000Number of Logic Elements/Cells32000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits339968

Overview of LFE2-35SE-5F672I – ECP2 Field Programmable Gate Array (FPGA), 672-BBGA

The LFE2-35SE-5F672I is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation’s ECP2 family. It delivers reprogrammable logic, embedded memory, and a large I/O count in a compact 672-ball BGA package.

Designed for industrial-grade embedded designs, this device combines substantial logic capacity and on-chip RAM with a wide operating temperature range and RoHS compliance, making it suitable for demanding system-level deployments that require reliable, reconfigurable logic resources.

Key Features

  • FPGA Core Field Programmable Gate Array architecture providing reprogrammable logic for custom hardware functions.
  • Logic Capacity 32,000 logic elements and 4,000 logic blocks to implement complex combinational and sequential logic.
  • On-Chip Memory Approximately 0.34 Mbits of embedded memory (339,968 total RAM bits) for buffering, state storage, and data processing.
  • High I/O Count 450 I/O pins to support wide interfacing and parallel connectivity to external devices and subsystems.
  • Package and Mounting 672-BBGA package (supplier device package: 672-FPBGA, 27×27 mm) with surface-mount assembly for compact PCB integration.
  • Power Core voltage supply range of 1.14 V to 1.26 V to match system power rails and optimize power distribution.
  • Industrial Temperature Range Specified operating temperature from −40°C to 100°C for reliable operation in harsh or wide-temperature environments.
  • Regulatory RoHS compliant for environmental and regulatory conformity in commercial and industrial products.

Typical Applications

  • Industrial Control Systems Implement custom control logic, I/O aggregation, and deterministic interfaces using the device’s industrial temperature rating and large I/O count.
  • Embedded System Integration Use the 32,000 logic elements and on-chip RAM to offload algorithms, glue logic, and protocol handling within compact embedded designs.
  • High‑Density I/O Platforms Leverage 450 I/Os for applications requiring broad sensor, actuator, or peripheral connectivity on a single FPGA.
  • Custom Logic and Acceleration Deploy reconfigurable logic blocks and embedded memory to accelerate specific datapath functions or implement application-specific peripherals.

Unique Advantages

  • Substantial Logic and Memory in One Device: 32,000 logic elements plus approximately 0.34 Mbits of RAM provide the resources needed for complex custom logic and buffering without external components.
  • Large I/O Capacity: 450 I/Os enable high‑pin-count interfacing and reduce the need for additional I/O expanders.
  • Industrial Reliability: −40°C to 100°C operating range supports deployment in temperature‑challenging environments.
  • Compact, Surface‑Mount BGA Package: 672-ball FPBGA (27×27 mm) package balances high integration density with PCB space efficiency.
  • RoHS Compliance: Environmentally compliant construction supports regulatory requirements for modern electronics manufacturing.
  • Tight Core Voltage Range: 1.14 V to 1.26 V supply specification facilitates predictable power design and integration with system rails.

Why Choose LFE2-35SE-5F672I?

The LFE2-35SE-5F672I positions itself as an industrial-grade FPGA option that combines significant logic density, embedded memory, and a very high I/O count in a compact 672-BBGA footprint. Its operating temperature range and RoHS compliance make it suitable for robust embedded and industrial designs where reliability and integration matter.

Choose this device when your design requires a balance of reconfigurable hardware capacity, on-chip memory, and broad connectivity in a surface-mount package that supports deployment across a wide temperature envelope.

Request a quote or submit an inquiry today to get pricing and availability for the LFE2-35SE-5F672I.

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