LFE2-35SE-5F672C

The LFE2-35SE-5F672C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation based on the ECP2 family. It delivers a high-density logic fabric with 32,000 logic elements, substantial embedded memory, and a large I/O count in a compact 672-BBGA package.

Designed for commercial-grade applications, this device targets designs that require high I/O density, embedded RAM, and low-voltage operation within a 0 °C to 85 °C operating range.

Key Features

• Core Logic — 32,000 logic elements provide the programmable resources for custom digital logic and complex combinational/sequential designs.
• On-chip Memory — Approximately 0.34 Mbits of embedded memory (339,968 total RAM bits) supports buffering, FIFOs, and small data stores without external memory.
• I/O Capacity — Up to 450 I/O pins support dense external interfacing and multiple parallel interfaces.
• Power Supply — Operates from a 1.14 V to 1.26 V core supply range for low-voltage FPGA implementations.
• Package & Mounting — 672-BBGA (supplier package: 672-FPBGA, 27×27) in a surface-mount form factor for space-efficient board designs.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for lead-free manufacturing and regulatory compatibility.
• Manufacturer — Lattice Semiconductor Corporation part number LFE2-35SE-5F672C.

Typical Applications

• Custom Digital Logic — Implement application-specific processing, protocol bridging, or glue logic using the device’s 32,000 logic elements.
• High‑Density I/O Interfacing — Use up to 450 I/Os to connect sensors, peripherals, or parallel buses without needing multiple interface chips.
• On‑Chip Buffering and Storage — Leverage approximately 0.34 Mbits of embedded RAM for temporary data buffering, FIFOs, and small memory structures.
• Compact Board Designs — The 672-BBGA surface-mount package enables high-functionality in space-constrained PCBs.

Unique Advantages

• High Logic Capacity: 32,000 logic elements allow substantial custom logic integration, reducing the need for multiple discrete devices.
• Significant Embedded Memory: Approximately 0.34 Mbits of on-chip RAM enables internal buffering and reduces dependence on external memory.
• Very High I/O Count: Up to 450 I/Os support complex interfacing and multi-channel connections directly to the FPGA.
• Low‑Voltage Core Operation: 1.14 V to 1.26 V supply range supports low-voltage system architectures and power-aware designs.
• Compact, Surface-Mount Packaging: 672-BBGA (27×27 FPBGA) provides a dense package for space-constrained applications while maintaining high pin count.
• RoHS Compliant: Supports lead-free manufacturing and environmental compliance requirements.

Why Choose LFE2-35SE-5F672C?

The LFE2-35SE-5F672C positions itself as a high-density, commercial-grade FPGA option for engineers needing a balance of logic capacity, embedded memory, and extensive I/O in a compact surface-mount package. Its combination of 32,000 logic elements, approximately 0.34 Mbits of RAM, and up to 450 I/Os makes it well suited for designs that consolidate multiple functions into a single programmable device.

This device is appropriate for teams focused on scalable, board-level integration where package density, low-voltage operation, and RoHS compliance are important selection criteria. Its specifications support a range of commercial embedded and interfacing designs while leveraging Lattice Semiconductor’s established product lineage.

Request a quote or submit your specification to receive pricing and availability for the LFE2-35SE-5F672C. Our team can provide a formal quote and support information to help move your design forward.