LFE2-35SE-5F484C
| Part Description |
ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA |
|---|---|
| Quantity | 37 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 331 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4000 | Number of Logic Elements/Cells | 32000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 339968 |
Overview of LFE2-35SE-5F484C – ECP2 Field Programmable Gate Array (FPGA) IC 331 339968 32000 484-BBGA
The LFE2-35SE-5F484C is an ECP2 family field programmable gate array from Lattice Semiconductor Corporation. It provides a mid-range programmable fabric with 32,000 logic elements, approximately 0.34 Mbits of embedded memory, and up to 331 I/Os in a 484-ball BGA package.
Designed for commercial-grade embedded and electronic applications, this FPGA balances integration and I/O density with a low core supply voltage (1.14 V–1.26 V) and standard commercial operating range (0 °C–85 °C). Its surface-mount 484-FPBGA (23×23) package supports compact board-level implementations.
Key Features
- Core Logic: 32,000 logic elements for implementing custom digital functions and glue logic in a compact footprint.
- Embedded Memory: Approximately 0.34 Mbits of on-chip RAM to support buffering, FIFOs, and small data tables without external RAM.
- I/O Density: Up to 331 I/Os to support complex interfacing with peripherals, sensors, and external devices.
- Power Supply: Narrow core voltage range (1.14 V to 1.26 V) for predictable power budgeting and supply design.
- Package and Mounting: 484-ball BGA (484-FPBGA, 23×23) in a surface-mount format for high-density PCB assembly.
- Commercial Grade & Thermal Range: Rated for commercial operation from 0 °C to 85 °C, suitable for standard consumer and enterprise environments.
- Environmental Compliance: RoHS compliant for global assembly and regulatory requirements.
Typical Applications
- Consumer Electronics: Implement user interface control, video or audio preprocessing, and other custom logic within compact, surface-mount designs.
- Communications Equipment: Provide glue logic, protocol adaptation, and I/O aggregation where high pin count and flexible logic are needed.
- Embedded Systems: Integrate peripheral control, data buffering, and custom state machines directly in the FPGA fabric to reduce BOM and board complexity.
- Test & Measurement: Implement data collection front-ends, timing control, and preprocessing functions using the on-chip RAM and abundant I/O.
Unique Advantages
- Balanced Integration: Combines 32,000 logic elements with substantial I/O count to consolidate multiple discrete components into a single programmable device.
- Compact Packaging: 484-ball BGA (23×23) enables dense PCB layouts while delivering high I/O availability for complex boards.
- Predictable Power Envelope: Narrow supply voltage range (1.14 V–1.26 V) simplifies power-supply design and margining for system integrators.
- Embedded Memory On-Board: Approximately 0.34 Mbits of RAM reduces dependence on external memory for small buffers and control structures.
- RoHS Compliance: Environmentally compliant for a wide range of commercial manufacturing flows.
Why Choose LFE2-35SE-5F484C?
The LFE2-35SE-5F484C positions itself as a practical, mid-range FPGA option for commercial embedded and electronics applications that require significant logic resources, abundant I/O, and onboard memory in a compact surface-mount BGA package. Its combination of 32,000 logic elements, approximately 0.34 Mbits of embedded RAM, and 331 I/Os supports consolidation of custom digital functions while helping to reduce external component count.
Engineers and product teams seeking a solution for consumer, communications, or embedded designs will find this device appropriate for creating flexible, field-programmable implementations with predictable power and thermal characteristics backed by Lattice Semiconductor Corporation’s product family support.
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