LFE2-35E-7F672C

The LFE2-35E-7F672C is a Lattice ECP2 family Field Programmable Gate Array (FPGA) packaged in a 672‑ball BGA (27 × 27 mm). It provides a balance of logic capacity, embedded memory and high I/O density for commercial embedded and system integration applications.

With 32,000 logic elements, approximately 0.34 Mbits of embedded RAM and up to 450 I/O pins, this device addresses applications requiring substantial on-chip logic, flexible memory resources and a high pin-count interface in a compact surface-mount package.

Key Features

• Logic Capacity — 32,000 logic elements and 4,000 logic blocks provide a substantial fabric for implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 339,968 bits (~0.34 Mbits) of on-chip RAM to support buffering, FIFOs and local data storage.
• High I/O Count — Up to 450 general-purpose I/O pins to support wide parallel interfaces and dense system connections.
• Programmable I/O — Flexible sysI/O buffer architecture (as defined by the ECP2 family) to support a range of interface standards and source-synchronous signaling.
• Clocking and Timing — On-chip clock management features available in the ECP2 family (PLL/DLL capabilities) to enable clock multiplication, division and phase adjustments for system timing.
• Package and Mounting — 672‑BBGA (supplier package: 672‑FPBGA, 27 × 27 mm) in a surface-mount package for dense, reliable board-level integration.
• Power — Low-voltage core supply operating between 1.14 V and 1.26 V for the FPGA core.
• Commercial Grade & RoHS — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Embedded Systems — Implement control logic, custom peripherals and glue logic within compact embedded products that require moderate logic and memory resources.
• Communications Equipment — Support high pin-count interfaces and source-synchronous I/O for network and telecom line cards or protocol bridging.
• Digital Signal Processing — Use on-chip memory and the ECP2 family’s DSP-oriented architecture to implement buffering and local signal processing functions.
• Interface and Bridge Logic — Consolidate multiple parallel interfaces and protocol adapters into a single device leveraging the FPGA’s I/O density and reprogrammability.

Unique Advantages

• High logic density — 32,000 logic elements accommodate sizable integrated designs without external glue logic.
• Compact, high‑pin package — 672‑ball BGA provides a large number of I/Os in a compact form factor for space-constrained boards.
• On‑chip memory — Approximately 0.34 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Low-voltage core operation — Core supply range of 1.14 V to 1.26 V supports modern board power domains and efficient power delivery.
• Commercial temperature rating — Rated for 0 °C to 85 °C, suitable for a wide range of commercial and enterprise applications.
• RoHS compliant — Meets environmental compliance requirements for lead‑free assembly.

Why Choose LFE2-35E-7F672C?

The LFE2-35E-7F672C combines substantial logic resources, embedded memory and a high I/O count in a compact 672‑ball BGA package, making it well suited for designers who need a versatile, reprogrammable device for commercial embedded and system integration projects. Its low-voltage core and RoHS compliance facilitate modern board-level implementations and regulatory needs.

This FPGA is appropriate for development teams and OEMs building communication interfaces, embedded controllers and signal processing modules that benefit from on-chip memory, flexible I/O and a sizable logic fabric, while leveraging the ECP2 family’s clocking and timing features for system synchronization.

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